Fabricating and cleaning chamber components having textured surfaces

Abstract

A method of fabricating a substrate processing chamber component involves forming a component having a textured surface and sweeping a jet of pressurized fluid across the textured surface of the component. The jet of fluid is pressurized sufficiently high to dislodge substantially all the particles from the textured surface. The method can be applied to dislodge grit particles from textured exposed surfaces formed by electromagnetic energy beam scanning and grit blasting. The method can also be applied to remove loosely adhered coating particles from the textured surfaces of coated components.

1 . A method of cleaning a substrate processing chamber component, the method comprising: 
 (a) providing a component having a textured surface;    (b) sweeping a jet of pressurized fluid across the textured surface of the component, the jet of fluid being pressurized sufficiently high to dislodge adhered or loose particles from the textured surface.    
   
   
       2 . A method according to  claim 1  wherein in (b) the jet of fluid is pressurized to at least 13100 kPa (1900 PSI).  
   
   
       3 . A method according to  claim 1  wherein in (b) the jet of pressurized fluid comprises water.  
   
   
       4 . A method according to  claim 1  wherein in (b) the jet of pressurized fluid is at an angle of from about 10 to about 90 degrees with respect to the textured surface, and the jet of pressurized fluid fans out at an angle of from about zero degrees to about 45 degrees.  
   
   
       5 . A method according to  claim 1  wherein (a) comprises grit blasting a surface of the component to form the textured surface, and wherein (b) comprises sweeping with a jet of fluid pressurized sufficiently high to dislodge the grit particles.  
   
   
       6 . A method according to  claim 5  wherein (a) comprises scanning a beam of electromagnetic energy across the surface of the component before grit blasting the surface.  
   
   
       7 . A method according to  claim 6  wherein (a) comprises forming a textured surface comprising depressions having diameters of from about 0.8 mm to about 3.5 mm.  
   
   
       8 . A method according to  claim 1  wherein (a) comprises forming a coating having the textured surface thereon, the textured surface having a surface roughness average of from about 7.62 micrometers (300 microinches) to about 43.18 micrometers (1700 microinches), and wherein (b) comprises sweeping with a jet of fluid that is pressurized sufficiently high to dislodge loose coating particles.  
   
   
       9 . A method according to  claim 1  wherein the component comprises at least one of an enclosure wall, a chamber shield, a target, a cover ring, a deposition ring, a support ring, insulator ring, a coil, coil support, shutter disk, and a surface of the substrate support.  
   
   
       10 . A component fabricated by a process comprising the cleaning method of  claim 1 , wherein the component comprises a textured surface that is substantially absent adhered or loose particles.  
   
   
       11 . A method of fabricating a substrate processing chamber component, the method comprising: 
 (a) providing a component having a surface;    (b) scanning a beam of electromagnetic energy across the surface to form a textured surface;    (c) grit blasting the textured surface with grit particles; and    (d) sweeping a jet of pressurized fluid across the textured exposed surface of the component, the fluid being pressurized to at least 689 kPa (100 PSI), whereby grit particles are dislodged from the textured surface.    
   
   
       12 . A method according to  claim 11  wherein in (d) the fluid is pressurized at from about 6895 kPa (1000 PSI) to about 34474 kPa (5000 PSI).  
   
   
       13 . A method according to  claim 11  wherein in (d) the fluid is pressurized to at least 13100 kPa (1900 PSI).  
   
   
       14 . A method according to  claim 11  wherein (b) comprises forming a textured surface comprising depressions having diameters of from about 0.8 mm to about 3.5 mm.  
   
   
       15 . A method according to  claim 11  wherein (b) comprises forming a first textured surface having a first surface roughness average of from about 63.5 micrometers (2500 microinches) to about 101.6 micrometers (4000 microinches).  
   
   
       16 . A method according to  claim 15  wherein (c) comprises grit blasting the first textured surface to provide a second textured surface overlying the first textured surface, the second surface having a second surface roughness average of from about 2.0 micrometers (80 microinches) to about 7.62 micrometers (300 microinches).  
   
   
       17 . A method according to  claim 11  wherein the component comprises at least one of an enclosure wall, a chamber shield, a target, a cover ring, a deposition ring, a support ring, insulator ring, a coil, coil support, shutter disk, and a surface of the substrate support.  
   
   
       18 . A component fabricated by the process of  claim 11 , wherein the component comprises a textured surface that is substantially absent grit particles.  
   
   
       19 . A method of fabricating a substrate processing chamber component, the method comprising: 
 (a) providing a component having a surface;    (b) spraying a coating on the surface, the coating having a textured surface thereon; and    (c) sweeping a jet of pressurized fluid across the textured surface of the component, the fluid being pressurized to at least 1379 kPa (200 PSI), whereby loose coating particles are dislodged from the textured surface.    
   
   
       20 . A method according to  claim 19  wherein in (c) the fluid is pressurized to at least 13100 kPa (1900 PSI).  
   
   
       21 . A method according to  claim 19  wherein (b) comprises twin wire arc spraying a metal coating on the surface.  
   
   
       22 . A method according to  claim 19  wherein (b) comprises plasma spraying a ceramic coating on the surface.  
   
   
       23 . A component fabricated according to the method of  claim 19 , wherein the component comprises a textured surface that is substantially absent loose coating particles.  
   
   
       24 . A method of fabricating a substrate processing chamber component, the method comprising: 
 (a) providing a component having a surface;    (b) scanning a beam of electromagnetic energy across the surface to form a first textured surface having a surface roughness of from about 63.5 micrometers (2500 microinches) to about 101.6 micrometers (4000 microinches);    (c) grit blasting the first textured surface with grit particles to form a second textured surface overlying the first textured surface, the second textured surface having a surface roughness average of from about 2.0 micrometers (80 microinches) to about 7.62 micrometers (300 microinches); and    (d) sweeping a jet of pressurized water across the first and second textured surfaces of the component, wherein the jet of water is (i) pressurized to at least 13100 kPa (1900 PSI), (ii) has an angle with respect to the surfaces of from about 10 degrees to about 90, and (iii) fans out at an angle of from about zero degrees to about 45 degrees, whereby grit particles are dislodged from the surfaces.    
   
   
       25 . A method of fabricating a substrate processing chamber component, the method comprising: 
 (a) providing a component having a roughened surface;    (b) spraying a coating on the roughened surface, the coating having a textured surface thereon, the textured surface having an average roughness of from about 3.81 micrometers (150 microinches) to about 43.18 micrometers (1700 microinches); and    (c) sweeping a jet of pressurized water across the textured surface of the component, wherein the jet of water is (i) pressurized to at least 13100 kPa (1900 PSI), (ii) has an angle with respect to the textured exposed surface of from about 10 degrees to about 90, and (iii) fans out at an angle of from about zero degrees to about 45 degrees, whereby coating particles are dislodged from the textured surface.