US2004232000A1PendingUtilityA1

Tin plating

32
Assignee: SHIPLEY CO LLCPriority: May 24, 2001Filed: Jun 21, 2004Published: Nov 25, 2004
Est. expiryMay 24, 2021(expired)· nominal 20-yr term from priority
Inventors:Jeffrey N. Crosby
Y10S428/935B32B 15/01C22C 13/00C25D 3/32C25D 3/60Y10T428/12715Y10T428/12722Y10T428/12708
32
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Claims

Abstract

Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating.

Claims

exact text as granted — not AI-modified
1 - 14 . (Canceled).  
     
     
         15 : A bright tin or bright lead-free tin-alloy having no whiskers after 4 months storage at 52° C. and 98% relative humidity.  
     
     
         16 - 17 . (Canceled).  
     
     
         18 : The bright tin or bright lead-free tin-alloy of  claim 15  having no whickers after 5 months of storage.  
     
     
         19 : The bright tin or bright lead-free tin-alloy of  claim 15  having no whickers after 6 months of storage.  
     
     
         20 : The bright lead-free tin-alloy of  claim 15 , wherein the alloying metal is nickel, copper, bismuth, zinc, silver or indium.  
     
     
         21 : The bright lead-free tin-alloy of  claim 15 , wherein the tin alloy contains 60 to 99.5 wt % tin and 0.5 to 40 wt % of another metal.  
     
     
         22 : The bright lead-free tin-alloy of  claim 15 , wherein the tin alloy contains 97 to 99 wt % tin and 1 to 3 wt % of copper.

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