Sintering method for W-Cu composite material without exuding of Cu

Abstract

Disclosed is a densification process of a W—Cu composite material, and more particularly, a sintering method for a W—Cu composite material without exuding of Cu. The sintering method comprises the steps of: holding a W—Cu composite power compact for a certain time at a Cu solid phase temperature or at a temperature just above a melting point and thus inducing a nearly complete densification; and sintering for a short time at a Cu liquidus temperature.

What is claimed is:  
     
         1 . A sintering method for a W—Cu composite material without exuding of Cu comprising the steps of: 
 holding a W—Cu composite material prepared by compacting a W—Cu composite powder for 0.5˜10 hours at 800˜1083° C. (except 1083° C.) which is a Cu solid phase temperature range under a reduction atmosphere; and  
 increasing temperature to 1200˜1400° C. and thereby cooling without a holding time.  
 
     
     
         2 . A sintering method for a W—Cu composite material without exuding of Cu comprising the steps of holding a W—Cu composite material prepared by compacting a W—Cu composite powder for 0.5˜10 hours at 1083˜1150° C. which is just above a Cu melting point under a reduction atmosphere; and 
 increasing temperature to 1200-1400° C. and thereby cooling without a holding time.  
 
     
     
         3 . The method of  claim 1  or  2 , wherein the WCu composite powder prepared by a method disclosed in the Korean patent application No. 24857 in 2002 is prepared by mixing WO 3 /WO  2.9  powder with CuO/Cu 2 O milling, and performing a heat treatment for reduction at a hydrogen atmosphere, and has a round shape of a certain size that W powder surrounds Cu powder.