US2003190870A1PendingUtilityA1
Cleaning ceramic surfaces
Est. expiryApr 3, 2022(expired)· nominal 20-yr term from priority
B08B 3/08B08B 7/0035B08B 7/04
42
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
Method and apparatus for cleaning ceramic surfaces of parts used, for example, and without limitation, in semiconductor processing equipment. In particular, one embodiment of the present invention is a method for cleaning a ceramic part that includes steps of: (a) treating the surface using one or more first mechanical processes; (b) treating the surface using one or more chemical processes; (c) plasma conditioning the surface; and (d) treating the surface using one or more second mechanical processes.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method for cleaning a part having a ceramic surface which comprises steps of:
treating the surface using one or more first mechanical processes; treating the surface using one or more chemical processes; plasma conditioning the surface; and treating the surface using one or more second mechanical processes.
2 . The method of claim 1 wherein the step of treating the surface using one or more first mechanical processes includes bead-blasting.
3 . The method of claim 1 wherein the step of plasma conditioning comprises inductively coupling energy to a plasma in a chamber and exposing the surface to the plasma in the chamber.
4 . The method of claim 3 which further includes forming the plasma utilizing precursors that include an inert gas.
5 . The method of claim 4 wherein the inert gas comprises Ar.
6 . The method of claim 4 wherein the precursors further include a reactive chemical.
7 . The method of claim 6 wherein the reactive chemical comprises Cl 2 .
8 . The method of claim 6 wherein the reactive chemical comprises BCl 3 .
9 . The method of claim 1 wherein the step of plasma conditioning comprises capacitively coupling energy to a plasma in a chamber and exposing the surface to the plasma in the chamber.
10 . The method of claim 9 wherein the step of exposing comprises disposing the surface in a plasma chamber, and the step of capacitively coupling includes forming the plasma utilizing precursors that include an inert gas.
11 . The method of claim 10 wherein the inert gas comprises Ar.
12 . The method of claim 10 wherein the precursors further include a reactive chemical.
13 . The method of claim 1 wherein the step of plasma conditioning comprises generating a plasma, flowing the plasma into a chamber, and exposing the surface to the plasma in the chamber.
14 . The method of claim 13 wherein the step of generating includes exposing a gas to microwaves.
15 . The method of claim 13 wherein the step of generating includes exposing a gas to RF energy.
16 . The method of claim 1 wherein the step of treating the surface using one or more first mechanical processes comprises steps of:
rinsing the surface using pressurized deionized water; and
propelling CO 2 pellets against the surface.
17 . The method of claim 1 wherein the step of treating the surface using one or more chemical processes comprises steps of:
dipping the part in NH 4 OH:H 2 O 2 :H 2 O; and
dipping the part in HF:HNO 3 :H 2 O.
18 . The method of claim 1 wherein the step of treating the surface using one or more second mechanical processes comprises steps of:
propelling CO 2 snow against the surface; and
ultrasonically cleaning the surface using deionized water.
19 . A method for cleaning a part having a ceramic surface which comprises steps of:
treating the surface using one or more first mechanical processes; treating the surface using one or more chemical processes; exposing the surface to H 2 SO 4 :H 2 O 2 ; and treating the surface using one or more second mechanical processes.
20 . The method of claim 19 wherein the step of treating the surface using one or more first mechanical processes includes bead-blasting.
21 . A method for cleaning a part having a ceramic surface which comprises steps of:
treating the surface using one or more first mechanical processes; treating the surface using one or more chemical processes; exposing the surface to NMD-3; and treating the surface using one or more second mechanical processes.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.