Apparatus and methods for improving uniform cover tape adhesion on a carrier tape

Abstract

Apparatus and methods are presented herein for uniformly sealing and peeling a cover tape to/from a carrier tape. The carrier tapes of the present invention include surface transitions that minimizes/eliminates surface irregularities and distortions such that the cover tapes can be uniformly sealed and peeled from the carrier tapes. The surface transitions act as physical barriers to prevent propagation of surface irregularities and distortions from the thermoformed pocket area into the heat bonding zones. The surface transitions also act as stiffening members to keep the heat bonding zones as flat as possible during subsequent handling of the carrier tape. The surface transitions may be in the form of continuous or intermittent ribs, step portions, or single or double sided grooves. Depressed portions in between the pockets can also be used to minimize the presence of surface distortions on the bonding zones.

I claim:  
     
         1 . An apparatus for storing a plurality of components, comprising: 
 a carrier tape having: 
 a plurality of pockets adapted to receive the plurality of components, the plurality of pockets being formed along a longitudinal direction of the carrier tape;  
 a pair of bonding zones, each bonding zone formed longitudinally along the outer periphery of the carrier tape on opposite sides of the plurality of pockets;  
 a plurality of depressed portions, each depressed portion formed in between each of the plurality of the pockets along the longitudinal direction of the carrier tape, and wherein the depressed portions assist in providing a substantially uniform surface having minimal surface distortions on the pair of bonding zones; and  
 a cover tape adapted to cover the plurality of pockets and bonded to the carrier tape at the pair of bonding zones such that the plurality of components are retained therein.  
   
     
     
         2 . The apparatus according to  claim 1 , wherein the carrier tape further comprises a plurality of advancement holes formed longitudinally adjacent to one of the pair of bonding zones.  
     
     
         3 . The apparatus according to  claim 1 , wherein the carrier tape is made from one of thermoplastic resin, polystyrene, and acrylonitrile butadiene-styrene.  
     
     
         4 . The apparatus according to  claim 1 , wherein the cover tape is made from one of polyester, polypropylene, and polyethylene.  
     
     
         5 . The apparatus according to  claim 1 , wherein the cover tape is heat bonded to the carrier tape at the pair of bonding zones.  
     
     
         6 . The apparatus according to  claim 1 , wherein the cover tape is bonded to the pair of bonding zones with a substantially uniform tape release tension along the longitudinal direction of the carrier tape.  
     
     
         7 . A system for packaging a plurality of components in a plurality of pockets of a carrier tape, comprising; 
 means for positioning the plurality of components in the plurality of pockets;    means for sealing the plurality of pockets using a cover tape, wherein the cover tape seals the plurality of pockets on bonding zones of the carrier tape; and    means for minimizing the presence of surface distortions on the bonding zones, wherein the means for minimizing comprises forming a plurality of depressed portions in between the plurality of the pockets before positioning the plurality of components in the plurality of pockets, wherein the plurality of depressed portions assist in providing a substantially uniform surface on the bonding zones.    
     
     
         8 . The system according to  claim 7 , wherein the means for sealing the plurality of pockets includes positioning the cover tape on the bonding zones in a longitudinal direction of the carrier tape.  
     
     
         9 . The system according to  claim 7 , wherein the carrier tape further comprises a plurality of advancement holes formed longitudinally adjacent to one of the bonding zones.  
     
     
         10 . The system according to  claim 7 , wherein the plurality of components comprises one of semiconductor chips, devices, and integrated circuits.  
     
     
         11 . The system according to  claim 7 , wherein the carrier tape is made from one of thermoplastic resin, polystyrene, and acrylonitrile butadiene-styrene.  
     
     
         12 . The system according to  claim 7 , wherein the cover tape is made from one of polyester, polypropylene, and polyethylene.  
     
     
         13 . The system according to  claim 7 , wherein the means for sealing comprises heat bonding the cover tape to the carrier tape at the bonding zones.  
     
     
         14 . A method of manufacturing a carrier tape, the method comprising the steps of: 
 identifying a pocket forming zone and a pair of bonding zones, each of the pair of bonding zones being disposed in a longitudinal direction of the carrier tape on opposite sides of the pocket forming zone;    forming a plurality of pockets and a plurality of depressed portions in the carrier tape within the pocket forming zone such that the presence of surface distortions on the bonding zones is minimal, each of the plurality of depressed portions disposed in the longitudinal direction of the carrier tape in between each of the plurality of pockets.    
     
     
         15 . The method according to  claim 14 , wherein the step of forming the plurality of pockets includes the step of thermoforming the pockets.