US2002193552A1PendingUtilityA1

Flame retardant resin material and flame retardant resin composition

44
Assignee: NEC CORPPriority: Dec 15, 1998Filed: Feb 19, 2002Published: Dec 19, 2002
Est. expiryDec 15, 2018(expired)· nominal 20-yr term from priority
C08L 61/34C08G 14/10C08G 59/08H05K 1/0346Y10S428/901Y10T428/31942
44
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

The present invention provides a flame retardant phenol resin material which includes a phenol condensate, wherein a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D), and also provides a flame retardant epoxy resin material which includes an epoxy resin obtained by glycidyl-etherification of at least a part of phenolic hydroxyl groups of a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D).

Claims

exact text as granted — not AI-modified
What is claimed:  
     
         1 . The flame retardant phenol resin material, comprising: 
 A phenol condensate, wherein a poly-aromatic compound obtained be a condensation reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as a heteroatom are condensed via aldehydes (D),    wherein said aromatics (B) are represented by the following chemical formula (1),   XH 2 C—R 1 —CH 2 X  (1)   wherein R 1  is any one of biphenyl derivatives, phenylene derivatives, naphthalene derivatives, biphenylene derivatives, fluorine derivatives, bis-phenol fluorine derivatives, and X is any one of halogen atoms, hydroxyl groups and alkoxyl groups having not larger than 10 carbon atoms,    wherein said flame retardant material further comprises at least a flame retardant phenol resin material, and    said flame retardant material further comprises an aromatic thermosetting resin comprising aromatic rings on a main chain skeleton.    
     
     
         2 . The flame retardant resin composition as claimed in  claim 1 , wherein said aromatic thermosetting resin comprises an epoxy resin having a novolak structure.  
     
     
         3 . The flame retardant resin composition as claimed in  claim 1 , wherein said aromatic thermosetting resin comprises a phenol resin having a novolak structure.  
     
     
         4 . The flame retardant resin composition as claimed in  claim 1 , wherein said aromatic thermosetting resin comprises a phenol aralkyl epoxy resin having aromatic rings on a novolak-structured main chain.  
     
     
         5 . The flame retardant resin composition as claimed in  claim 4 , wherein said phenol aralkyl epoxy resin has at least any one of biphenyl derivatives and phenylene derivatives on said novolak-structured main chain.  
     
     
         6 . The flame retardant resin composition as claimed in  claim 1 , wherein said aromatic thermosetting resin comprises a phenol aralkyl phenol resin having aromatic rings on a novolak-structure main chain.  
     
     
         7 . The flame retardant resin composition as claimed in  claim 6 , wherein said phenol aralkyl phenol resin has at least any one of biphenyl derivatives and phenylene derivatives on said novolak-structure main chain.  
     
     
         8 . A flame retardant phenol resin material, comprising: 
 A phenol condensate, wherein a poly-aromatic compound obtained by a condensation reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as a heteroatom are condensed via aldehydes (D),    wherein said aromatics (B) are represented by the following chemical formula (1),   XH 2 C—R 1 —CH 2 X  (1)   wherein R 1  is any one of biphenyl derivatives, phenylene derivatives, naphthalene derivatives, biphenylene derivatives, fluorine derivatives, bis-phenol fluorine derivatives, and X is any one of halogen atoms, hydroxyl groups and alkoxyl groups having not larger than 10 carbon atoms,    said flame retardant material further comprises at least a flame retardant phenol resin material, and said flame retardant material further comprises an aromatic thermosetting resin comprising aromatic rings on a main chain skeleton.    
     
     
         9 . A flame retardant epoxy resin material, comprising: 
 an epoxy resin obtained by glycidyl-etherification of at least a part of phenolic hydroxyl groups of a poly-aromatic compound obtained by a condensation reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom via aldehydes (D).    
     
     
         10 . The flame retardant epoxy resin material as claimed in  claim 9 , wherein said aromatics (B) are represented by the following chemical formula (1) 
       XH 2 C—R 1 —CH 2 X  (1) where R 1  is any one of biphenyl derivatives, phenylene derivatives, naphthalene derivatives, biphenylene derivatives, fluorine derivatives, bis-phenol fluorine derivatives, and X is any one of halogen atoms, hydroxyl groups and alkoxyl groups having not larger than 10 carbon atoms.    
     
     
         11 . The flame retardant epoxy resin material as claimed in  claim 10 , wherein said R 1  is any one of biphenyl derivatives and phenylene derivatives.  
     
     
         12 . The flame retardant epoxy resin material as claimed in  claim 9 , wherein said heterocyclic compound (C) is triazines.  
     
     
         13 . The flame retardant epoxy resin material as claimed in  claim 12 , wherein said triazines include compounds having at least one amino group.  
     
     
         14 . The flame retardant epoxy resin material as claimed in  claim 12 , wherein said triazines are at least one compound selected from the groups consisting of melamine, acetoguanamine and benzoguanamine.  
     
     
         15 . A flame retardant resin composition, comprising: at least a flame retardant epoxy resin material as claimed in  claim 9 .  
     
     
         16 . The flame retardant resin composition as claimed in  claim 15 , further including an aromatic thermosetting resin having aromatic rings on a main chain skeleton.  
     
     
         17 . The flame retardant resin composition as claimed in  claim 16 , wherein said aromatic thermosetting resin comprises an epoxy resin having a novolak structure.  
     
     
         18 . The flame retardant resin composition as claimed in  claim 16 , wherein said aromatic thermosetting resin comprises a phenol resin having a novolak structure.  
     
     
         19 . The flame retardant resin composition as claimed in  claim 16 , wherein said aromatic thermosetting resin comprises a phenol aralkyl epoxy resin having aromatic rings on a novolak-structured main chain.  
     
     
         20 . The flame retardant resin composition as claimed in  claim 19 , wherein said phenol aralkyl epoxy resin has at least any one of biphenyl derivatives and phenylene derivatives on said novolak-structured main chain.  
     
     
         21 . The flame retardant resin composition as claimed in  claim 16 , wherein said aromatic thermosetting resin comprises a phenol aralkyl phenol resin aromatic rings on a novolak-structured main chain.  
     
     
         22 . The flame retardant resin composition as claimed in  claim 21 , wherein said phenol aralkyl phenol resin has at least any one of biphenyl derivatives and phenylene derivatives on said novolak-structured main chain.  
     
     
         23 . The flame retardant resin composition as claimed in  claim 15 , further including an aromatic thermoplastic resin having aromatic rings on a main chain skeleton.  
     
     
         24 . A semiconductor device having a sealing resin which comprises a flame retardant resin composition as claimed in  claim 15 .  
     
     
         25 . A printed wiring board having an insulator which comprises a flame retardant resin composition as claimed in  claim 15 .  
     
     
         26 . A molding material comprising a flame retardant resin composition as claimed in claim  15 .

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.