Inventor · disambiguated record
Holger Huebner
Also filed as: HUEBNER HOLGER
10 granted patents·1 pending application·271 citations·filing 1989–2013
89Inventor score
Top patents by PatentIndex Score
11 records- 0189US5419806AMethod for manufacturing a three-dimensional circuit apparatusSIEMENS AG·Filed 1994·Granted May 30, 1995·118 cites·26 claims
- 0282US4980316AMethod for producing a resist structure on a semiconductorSIEMENS AG·Filed 1989·Granted Dec 25, 1990·63 cites·15 claims
- 0381US4950377AApparatus and method for reactive ion etchingSIEMENS AG·Filed 1989·Granted Aug 21, 1990·26 cites·13 claims
- 0462US8872335B2Electronic device and method of manufacturing sameHUEBNER HOLGER·Filed 2007·Granted Oct 28, 2014·3 cites·21 claims
- 0562US5901901ASemiconductor assembly with solder material layer and method for soldering the semiconductor assemlySIEMENS AG·Filed 1997·Granted May 11, 1999·28 cites·3 claims
- 0652US9414447B2LED moduleOSRAM GMBH·Filed 2013·Granted Aug 9, 2016·0 cites·20 claims
- 0750US5474651AMethod for filling via holes in a semiconductor layer structureSIEMENS AG·Filed 1994·Granted Dec 12, 1995·20 cites·11 claims
- 0845US6773956B2Method for contact-connecting a semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 10, 2004·2 cites·16 claims
- 0943US6268659B1Semiconductor body with layer of solder material comprising chromiumINFINEON TECHNOLOGIES AG·Filed 1997·Granted Jul 31, 2001·11 cites·8 claims
- 1037US2009045444A1Integrated device and circuit systemHUEBNER HOLGER·Filed 2007·Application pending·0 cites
- 1130US5610531ATesting method for semiconductor circuit levelsSIEMENS AG·Filed 1995·Granted Mar 11, 1997·0 cites·13 claims
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