Inventor · disambiguated record
Kazuhiro Ikuina
Also filed as: IKUINA KAZUHIRO
14 granted patents·366 citations·filing 1994–2002
94Inventor score
Files withNEC CORP14
Top patents by PatentIndex Score
14 records- 0195US6774748B1RF package with multi-layer substrate having coplanar feed through and connection interfaceNEC CORP·Filed 2000·Granted Aug 10, 2004·125 cites·7 claims
- 0282US6130111APackaged semiconductor device and method of manufacturing the sameNEC CORP·Filed 1999·Granted Oct 10, 2000·57 cites·2 claims
- 0379US5952712APackaged semiconductor device and method of manufacturing the sameNEC CORP·Filed 1997·Granted Sep 14, 1999·49 cites·13 claims
- 0478US6903700B2High frequency circuit substrate and method for forming the sameNEC CORP·Filed 2002·Granted Jun 7, 2005·23 cites·51 claims
- 0575US5714112AProcess for producing a silica sintered product for a multi-layer wiring substrateNEC CORP·Filed 1995·Granted Feb 3, 1998·43 cites·4 claims
- 0650US6348424B1Low-temperature calcined glass ceramic and a manufacturing process thereforNEC CORP·Filed 1999·Granted Feb 19, 2002·13 cites·35 claims
- 0748US5902758ALow temperature firing glass-ceramic substrate and production process thereofNEC CORP·Filed 1998·Granted May 11, 1999·12 cites·7 claims
- 0845US6467137B1Method of manufacturing an ink jet recording headNEC CORP·Filed 1999·Granted Oct 22, 2002·10 cites·7 claims
- 0940US5753376AMultilayer glass ceramic substrate and process for producing the sameNEC CORP·Filed 1997·Granted May 19, 1998·7 cites·3 claims
- 1039US5506058AMutlilayer glass ceramic substrate and method of fabricating the sameNEC CORP·Filed 1994·Granted Apr 9, 1996·10 cites·8 claims
- 1137US5948192AGlass-ceramic substrate and method of producing the sameNEC CORP·Filed 1997·Granted Sep 7, 1999·7 cites·3 claims
- 1235US5989484AMultilayer glass ceramic substrate and process for producing the sameNEC CORP·Filed 1997·Granted Nov 23, 1999·4 cites·8 claims
- 1334US5728470AMulti-layer wiring substrate, and process for producing the sameNEC CORP·Filed 1995·Granted Mar 17, 1998·4 cites·6 claims
- 1431US5757062ACeramic substrate for semiconductor deviceNEC CORP·Filed 1997·Granted May 26, 1998·2 cites·16 claims
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