Inventor · disambiguated record
Ko-Bin Kao
Also filed as: KAO KO-BIN
21 granted patents·3 pending applications·292 citations·filing 2003–2024
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD17TAIWAN SEMICONDUCTOR MFG3CHANG CHING-YU1LIN CHUNG-YI1WANG CHIEN-WEI1
Top patents by PatentIndex Score
24 records- 0196US9099530B2Methods of patterning small via pitch dimensionsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 4, 2015·108 cites·20 claims
- 0295US11688730B2Method and system of manufacturing conductors and semiconductor device which includes conductorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·2 cites·20 claims
- 0394US8728332B2Methods of patterning small via pitch dimensionsLIN CHUNG-YI·Filed 2012·Granted May 20, 2014·152 cites·19 claims
- 0491US8563231B2Patterning process and materials for lithographyWANG CHIEN-WEI·Filed 2011·Granted Oct 22, 2013·10 cites·22 claims
- 0590US10388644B2Method of manufacturing conductors and semiconductor device which includes conductorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 20, 2019·4 cites·20 claims
- 0688US9984876B2Lithographic technique for feature cut by line-end shrinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 29, 2018·3 cites·20 claims
- 0786US10978439B2Method and system of manufacturing conductors and semiconductor device which includes conductorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 0886US9613850B2Lithographic technique for feature cut by line-end shrinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·3 cites·20 claims
- 0985US10388523B2Lithographic technique for feature cut by line-end shrinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 20, 2019·2 cites·20 claims
- 1084US12278230B2Method of manufacturing conductors for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 1181US11029603B2Chemical replacement systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 8, 2021·3 cites·20 claims
- 1277US2024344915A1System and method for liquid leak detectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1374US12025533B2System and method for liquid leak detectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·20 claims
- 1474US11199466B2System and method for liquid leak detectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 14, 2021·1 cites·13 claims
- 1570US11004709B2Method for monitoring gas in wafer processing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 11, 2021·1 cites·20 claims
- 1670US10943802B2Photoresist bottle containerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 9, 2021·1 cites·20 claims
- 1768US11454891B2Manufacturing method of semiconductor device and semiconductor processing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 27, 2022·0 cites·20 claims
- 1867US10763113B2Lithographic technique for feature cut by line-end shrinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 1966US11899368B2Manufacturing method of semiconductor device and semiconductor processing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2054US11061333B2Manufacturing method of semiconductor device and semiconductor processing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 13, 2021·0 cites·20 claims
- 2148US8101340B2Method of inhibiting photoresist pattern collapseCHANG CHING-YU·Filed 2007·Granted Jan 24, 2012·0 cites·20 claims
- 2246US9003336B2Mask assignment optimizationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 7, 2015·0 cites·18 claims
- 2340US2011212403A1Method and apparatus for enhanced dipole lithographyTAIWAN SEMICONDUCTOR MFG·Filed 2010·Application pending·0 cites
- 2437US2005048208A1Resist supply apparatus with resist recycling function, coating system having the same and method of resist recyclingFiled 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →