Inventor · disambiguated record
Paul I. Mikulan
Also filed as: MIKULAN PAUL I
11 granted patents·48 citations·filing 2001–2017
86Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO3BAKKER CHRIS1BURTON GREGORY N1GE NING1HEWLETT PACKARD DEVELOPMENT CO LP1
Top patents by PatentIndex Score
11 records- 0194US9592664B2Circuit that selects EPROMs individually and in parallelGE NING·Filed 2011·Granted Mar 14, 2017·17 cites·13 claims
- 0283US8444255B2Power distribution in a thermal ink jet printheadBAKKER CHRIS·Filed 2011·Granted May 21, 2013·14 cites·19 claims
- 0364US6740536B2Devices and methods for integrated circuit manufacturingHEWLETT PACKARD DEVELPMENT COR·Filed 2001·Granted May 25, 2004·10 cites·6 claims
- 0461US9864524B2Circuit that selects EPROMs individually and in parallelHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2017·Granted Jan 9, 2018·0 cites·19 claims
- 0560US9524780B2Memory cell having closed curve structureVILLAVELEZ REYNALDO V·Filed 2011·Granted Dec 20, 2016·3 cites·15 claims
- 0658US10504910B2Memory cell having closed curve structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Dec 10, 2019·0 cites·18 claims
- 0752US9536112B2Delaying or deterring counterfeiting and/or cloning of a componentNEO TECKKHIM·Filed 2012·Granted Jan 3, 2017·2 cites·25 claims
- 0845US9340023B2Methods of making inkjet print heads using a sacrificial substrate layerST MICROELECTRONICS INC·Filed 2013·Granted May 17, 2016·0 cites·20 claims
- 0945US7004558B2Fluid ejection device including integrated circuit with shielding elementHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Feb 28, 2006·2 cites·14 claims
- 1043US7488611B2Devices and methods for integrated circuit manufacturingHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Feb 10, 2009·0 cites·7 claims
- 1141US8476742B2Fluid ejection device comprising substrate contact viaBURTON GREGORY N·Filed 2008·Granted Jul 2, 2013·0 cites·20 claims
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