Inventor · disambiguated record
Sheng-Mou Lin
Also filed as: LIN SHENG-MOU
8 granted patents·6 pending applications·143 citations·filing 2016–2023
80Inventor score
Files withMEDIATEK INC14
Top patents by PatentIndex Score
14 records- 0195US9881882B2Semiconductor package with three-dimensional antennaMEDIATEK INC·Filed 2016·Granted Jan 30, 2018·140 cites·26 claims
- 0273US12062864B2High gain and fan beam antenna structuresMEDIATEK INC·Filed 2023·Granted Aug 13, 2024·0 cites·9 claims
- 0373US10679949B2Semiconductor package assembly with redistribution layer (RDL) traceMEDIATEK INC·Filed 2017·Granted Jun 9, 2020·2 cites·21 claims
- 0467US10340235B2Semiconductor package with three-dimensional antennaMEDIATEK INC·Filed 2017·Granted Jul 2, 2019·1 cites·18 claims
- 0564US11764475B2High gain and fan beam antenna structures and associated antenna-in-packageMEDIATEK INC·Filed 2021·Granted Sep 19, 2023·0 cites·11 claims
- 0651US2024038443A18-shaped inductor with ground bar structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 0751US2024038690A1Semiconductor devices with a structure capable of suppressing coupling noise suppressionMEDIATEK INC·Filed 2023·Application pending·0 cites
- 0850US2023253390A1Semiconductor package assemblyMEDIATEK INC·Filed 2023·Application pending·0 cites
- 0949US10910323B2Semiconductor package with reduced noiseMEDIATEK INC·Filed 2019·Granted Feb 2, 2021·0 cites·14 claims
- 1047US2023014046A1Semiconductor devices with in-package PGS for coupling noise suppressionMEDIATEK INC·Filed 2022·Application pending·0 cites
- 1142US10446508B2Semiconductor package integrated with memory dieMEDIATEK INC·Filed 2017·Granted Oct 15, 2019·0 cites·28 claims
- 1242US10068857B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Sep 4, 2018·0 cites·36 claims
- 1342US2020051927A1Semiconductor device with an em-integrated damperMEDIATEK INC·Filed 2019·Application pending·0 cites
- 1442US2020051925A1Semiconductor device with an em-integrated damperMEDIATEK INC·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →