Inventor · disambiguated record
Shing-Tza Liou
Also filed as: LIOU SHING-TZA
9 granted patents·8 pending applications·18 citations·filing 2003–2011
82Inventor score
Files withFUKUI PREC COMPONENT SHENZHEN9FOXCONN ADVANCED TECH INC3IND TECH RES INST1LIOU SHING-TZA1LIU RUI-WU1
Top patents by PatentIndex Score
17 records- 0168US7728232B2Printed circuit board assembly having adhesive layerFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Granted Jun 1, 2010·5 cites·20 claims
- 0265US8164000B2Flexible printed circuit boards including carbon nanotube bundlesYEH TSO-HUNG·Filed 2008·Granted Apr 24, 2012·3 cites·19 claims
- 0363US8052881B2Method of manufacturing multilayer printed circuit board having buried holesFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Nov 8, 2011·3 cites·11 claims
- 0462US8205330B2Method for manufacturing a printed circuit boardZHANG QI·Filed 2008·Granted Jun 26, 2012·2 cites·9 claims
- 0561US7511962B2Flexible printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2007·Granted Mar 31, 2009·2 cites·20 claims
- 0658US7985482B2Stiffener sheet and flexible printed circuit board using the sameFOXCONN ADVANCED TECH INC·Filed 2008·Granted Jul 26, 2011·2 cites·7 claims
- 0756US7998332B2Electroplating methodFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Aug 16, 2011·0 cites·8 claims
- 0853US8071887B2Printed circuit board and method for manufacturing sameLIOU SHING-TZA·Filed 2008·Granted Dec 6, 2011·1 cites·14 claims
- 0952US2009120671A1Fpcb substrate and method of manufacturing the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 1049US2009246357A1Method of forming circuits on circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 1147US2009038828A1Flexible printed circuit board substrate and flexible printed circuit board fabricated using the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 1244US8453324B2Method of manufacturing FPCB substrateLIU RUI-WU·Filed 2011·Granted Jun 4, 2013·0 cites·4 claims
- 1344US2009178276A1Method for forming circuit in making printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 1442US2009176080A1Stiffener and strengthened flexible printed circuit board having the sameFOXCONN ADVANCED TECH INC·Filed 2008·Application pending·0 cites
- 1542US2009166063A1Stiffener and strengthened flexible printed circuit board having the sameFOXCONN ADVANCED TECH INC·Filed 2008·Application pending·0 cites
- 1639US2009217520A1Method for forming solder lumps on printed circuit board substrateFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Application pending·0 cites
- 1738US2004126693A1Positive photosensitive composition and method of pattern formation using the sameIND TECH RES INST·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →