Inventor · disambiguated record
Takayuki Takahagi
Also filed as: TAKAHAGI TAKAYUKI
6 granted patents·3 pending applications·36 citations·filing 1988–2010
79Inventor score
Files withSEMICONDUCTOR TECH ACAD RES CT3RORZE CORP2DAIKEN CHEMICAL CO LTD1ELPIDA MEMORY INC1RESEARCH DEV CORP1
Top patents by PatentIndex Score
9 records- 0154US7749920B2Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the sameRORZE CORP·Filed 2004·Granted Jul 6, 2010·5 cites·9 claims
- 0254US7022598B2Method of producing multilayer interconnection structureSEMICONDUCTOR TECH ACAD RES CT·Filed 2004·Granted Apr 4, 2006·8 cites·14 claims
- 0353US5007372AVacuum depositing apparatusRESEARCH DEV CORP·Filed 1988·Granted Apr 16, 1991·19 cites·10 claims
- 0450US2009283013A1Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic componentsRORZE CORP·Filed 2009·Application pending·0 cites
- 0549US6852624B2Electroless plating process, and embedded wire and forming process thereofSEMICONDUCTOR TECH ACAD RES CT·Filed 2002·Granted Feb 8, 2005·4 cites·19 claims
- 0643US8158536B2Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the sameSAKURAI TOSHIO·Filed 2010·Granted Apr 17, 2012·0 cites·10 claims
- 0740US7371694B2Semiconductor device fabrication method and fabrication apparatusELPIDA MEMORY INC·Filed 2005·Granted May 13, 2008·0 cites·18 claims
- 0839US2007107317A1Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic componentsDAIKEN CHEMICAL CO LTD·Filed 2004·Application pending·0 cites
- 0934US2004213895A1Method of manufacturing multilevel interconnectionSEMICONDUCTOR TECH ACAD RES CT·Filed 2004·Application pending·0 cites
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