Inventor · disambiguated record
Richard J. Webb
Also filed as: WEBB RICHARD J
13 granted patents·7 pending applications·1,364 citations·filing 1992–2017
94Inventor score
Files with3M INNOVATIVE PROPERTIES CO11MINNESOTA MINING & MFG4MODULAR SERVICES COMPANY2LARSON ERIC G1WEBB RICHARD J1
Top patents by PatentIndex Score
20 records- 0198US5958794AMethod of modifying an exposed surface of a semiconductor waferMINNESOTA MINING & MFG·Filed 1996·Granted Sep 28, 1999·605 cites·60 claims
- 0297US5692950AAbrasive construction for semiconductor wafer modificationMINNESOTA MINING & MFG·Filed 1996·Granted Dec 2, 1997·252 cites·30 claims
- 0396US5219462AAbrasive article having abrasive composite members positioned in recessesMINNESOTA MINING & MFG·Filed 1992·Granted Jun 15, 1993·236 cites·40 claims
- 0494US7759050B2Method for manufacturing thin substrate using a laminate body3M INNOVATIVE PROPERTIES CO·Filed 2008·Granted Jul 20, 2010·26 cites·16 claims
- 0594US6007407AAbrasive construction for semiconductor wafer modificationMINNESOTA MINING & MFG·Filed 1997·Granted Dec 28, 1999·134 cites·14 claims
- 0688US6786810B2Abrasive article having a window system for polishing wafers, and methods3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted Sep 7, 2004·41 cites·11 claims
- 0783US6604985B2Abrasive article having a window system for polishing wafers, and methods3M INNOVATIVE PROPERTIES CO·Filed 2002·Granted Aug 12, 2003·26 cites·17 claims
- 0882US7449124B2Method of polishing a wafer3M INNOVATIVE PROPERTIES CO·Filed 2006·Granted Nov 11, 2008·8 cites·17 claims
- 0976US7950189B1Modular in-wall medical services unitMODULAR SERVICES COMPANY·Filed 2010·Granted May 31, 2011·9 cites·10 claims
- 1068US6997785B1Wafer planarization composition and method of use3M INNOVATIVE PROPERTIES CO·Filed 2004·Granted Feb 14, 2006·10 cites·16 claims
- 1164US7775000B2Modular in-wall medical services unitMODULAR SERVICES COMPANY·Filed 2002·Granted Aug 17, 2010·17 cites·44 claims
- 1257US2008026215A1Print-receptive electrostatic dissipating label3M INNOVATIVE PROPERTIES CO·Filed 2006·Application pending·0 cites
- 1351US7198560B2Wafer planarization composition and method of use3M INNOVATIVE PROPERTIES CO·Filed 2005·Granted Apr 3, 2007·0 cites·10 claims
- 1450US2008014532A1Laminate body, and method for manufacturing thin substrate using the laminate body3M INNOVATIVE PROPERTIES CO·Filed 2006·Application pending·0 cites
- 1548US2009017248A1Layered body and method for manufacturing thin substrate using the layered body3M INNOVATIVE PROPERTIES CO·Filed 2008·Application pending·0 cites
- 1645US2009017323A1Layered body and method for manufacturing thin substrate using the layered body3M INNOVATIVE PROPERTIES CO·Filed 2007·Application pending·0 cites
- 1744US11173069B2Earplug with stem comprising a sleeve3M INNOVATIVE PROPERTIES CO·Filed 2017·Granted Nov 16, 2021·0 cites·15 claims
- 1837US2012034426A1Article and method for bonding substrates with large topographiesWEBB RICHARD J·Filed 2010·Application pending·0 cites
- 1937US2002072296A1Abrasive article having a window system for polishing wafers, and methodsFiled 2000·Application pending·0 cites
- 2037US2013084459A1Low peel adhesiveLARSON ERIC G·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →