Inventor · disambiguated record
Ellis Lee
Also filed as: LEE ELLIS · LEE ELLIS M
13 granted patents·1 pending application·303 citations·filing 1980–2005
93Inventor score
Top patents by PatentIndex Score
14 records- 0192US6492732B2Interconnect structure with air gap compatible with unlanded viasUNITED MICROELECTRONICS CORP·Filed 2001·Granted Dec 10, 2002·66 cites·74 claims
- 0290US6492256B2Method for forming an interconnect structure with air gap compatible with unlanded viasUNITED MICROELECTRONICS CORP·Filed 2002·Granted Dec 10, 2002·56 cites·12 claims
- 0383US5933761ADual damascene structure and its manufacturing methodFiled 1998·Granted Aug 3, 1999·77 cites·42 claims
- 0470US6171960B1Method of fabricating copper interconnectionUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 9, 2001·38 cites·15 claims
- 0567US7412394B2System and method for founding establishment through internetUNITED MICROELECTRONICS CORP·Filed 2001·Granted Aug 12, 2008·2 cites·13 claims
- 0663US6914318B2Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the sameUNITED MICROELECTRONICS CORP·Filed 2003·Granted Jul 5, 2005·10 cites·35 claims
- 0761US6794752B2Bonding pad structureUNITED MICROELECTRONICS CORP·Filed 2001·Granted Sep 21, 2004·8 cites·10 claims
- 0859US6888247B2Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the sameUNITED MICROELECTRONICS CORP·Filed 2001·Granted May 3, 2005·8 cites·12 claims
- 0955US6245635B1Method of fabricating shallow trench isolationUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jun 12, 2001·20 cites·41 claims
- 1051US6940146B2Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the sameUNITED MICROELECTRONICS CORP·Filed 2003·Granted Sep 6, 2005·5 cites·17 claims
- 1151US2005131775A1Interconnect structure and method for manufacturing the sameUNITED MICROELECTRICS CORP·Filed 2005·Application pending·0 cites
- 1247US6987057B2Method making bonding padUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jan 17, 2006·2 cites·14 claims
- 1336US4431108AClothes hanger supportLEE ELLIS M·Filed 1980·Granted Feb 14, 1984·11 cites·13 claims
- 1434US6657283B2Reducing relative stress between HDP layer and passivation layerUNITED MICROELECTRONICS CORP·Filed 2002·Granted Dec 2, 2003·0 cites·25 claims
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