Inventor · disambiguated record
Jae June Kim
Also filed as: KIM JAE J · KIM JAE JUNE
10 granted patents·2 pending applications·629 citations·filing 1995–2011
91Inventor score
Top patents by PatentIndex Score
12 records- 0196US5625221ASemiconductor assembly for a three-dimensional integrated circuit packageSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Apr 29, 1997·296 cites·12 claims
- 0293US5930096AOvervoltage and surge protection circuit in a hard disk driveSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 27, 1999·104 cites·14 claims
- 0391US6013946AWire bond packages for semiconductor chips and related methods and assembliesSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Jan 11, 2000·142 cites·25 claims
- 0483US5954837AMethod for optimizing viterbi detector threshold valuesSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Sep 21, 1999·44 cites·20 claims
- 0572US7264995B2Method for manufacturing wafer level chip scale package using redistribution substrateEPWORKS CO LTD·Filed 2005·Granted Sep 4, 2007·8 cites·24 claims
- 0662US6828784B2Method and apparatus detecting base line popping noise in a read head and stabilizing the magnetic domain of merged magnetoresistive read-write heads using dc write current and read bias current for an assembled disk driveSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 7, 2004·5 cites·28 claims
- 0750US6092713AAutomated stacking and soldering apparatus for three dimensional stack package devices and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 25, 2000·18 cites·15 claims
- 0847US6954322B2Method and apparatus providing read channel optimization insurance to avoid divergence in channel optimization in an assembled disk driveSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 11, 2005·4 cites·11 claims
- 0942US8821826B2Method for regenerating silicon from silicon waste and silicon manufactured using the sameKIM GU SUNG·Filed 2009·Granted Sep 2, 2014·0 cites·6 claims
- 1040US2007284723A1Packaged integrated circuit deviceKIM JAE JUNE·Filed 2006·Application pending·0 cites
- 1137US5975402AStacking and soldering apparatus for three dimensional stack package devicesSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Nov 2, 1999·8 cites·15 claims
- 1234US2011272729A1Wafer level led interposerEPWORKS CO LTD·Filed 2011·Application pending·0 cites
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