Inventor · disambiguated record
Hironari Sasagawa
Also filed as: SASAGAWA HIRONARI
8 granted patents·3 pending applications·4 citations·filing 2019–2023
75Inventor score
Technology areasH10P
Files withTOKYO ELECTRON LTD11
Top patents by PatentIndex Score
11 records- 0188US11450537B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Sep 20, 2022·2 cites·22 claims
- 0282US12112954B2Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted Oct 8, 2024·1 cites·20 claims
- 0382US11810791B2Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted Nov 7, 2023·1 cites·19 claims
- 0473US11961746B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 0570US2024120187A1Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0665US2022301881A1Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0764US11380555B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jul 5, 2022·0 cites·19 claims
- 0860US11862441B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jan 2, 2024·0 cites·18 claims
- 0953US2023369032A1Etching processing apparatus, etching processing system, analysis apparatus, etching processing method, and storage mediumTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1051US11728166B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Aug 15, 2023·0 cites·22 claims
- 1148US10916420B2Processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Feb 9, 2021·0 cites·23 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →