Inventor · disambiguated record
Jeng-Hao Lin
Also filed as: LIN JENG-HAO
4 granted patents·6 citations·filing 2011–2020
65Inventor score
Technology areasH10P
Top patents by PatentIndex Score
4 records- 0179US9123754B2Bonding alignment tool and methodSHIH YUN-TAI·Filed 2011·Granted Sep 1, 2015·6 cites·20 claims
- 0269US11721662B2Wafer bonding method and wafer bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
- 0362US10847490B2Bonding alignment toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 0451US10396054B2Bonding alignment toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 27, 2019·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →