Inventor · disambiguated record
Jeung-Il Kim
Also filed as: KIM JEUNG-IL
3 granted patents·3 citations·filing 2004–2014
52Inventor score
Top patents by PatentIndex Score
3 records- 0162US7952175B2Lead frame, semiconductor package including the lead frame and method of forming the lead frameSAMSUNG TECHWIN CO LTD·Filed 2008·Granted May 31, 2011·3 cites·14 claims
- 0237US9299588B2Method of manufacturing lead frameHAESUNG DS CO LTD·Filed 2014·Granted Mar 29, 2016·0 cites·5 claims
- 0336US7341889B2Lead frame for semiconductor package and method of fabricating semiconductor packageSAMSUNG TECHWIN CO LTD·Filed 2004·Granted Mar 11, 2008·0 cites·9 claims
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