Inventor · disambiguated record
Takashi Kumaki
Also filed as: KUMAKI TAKASHI
22 granted patents·5 pending applications·120 citations·filing 1981–2022
93Inventor score
Files withVICTOR COMPANY OF JAPAN7HITACHI CHEMICAL CO LTD5SHOWA DENKO MATERIALS CO LTD4MITSUI TAKEDA CHEMICALS INC3MIYASAKA MASAHIRO3
Top patents by PatentIndex Score
27 records- 0186US6204300B1Low resilience urethane foamTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1999·Granted Mar 20, 2001·57 cites·8 claims
- 0275US8198008B2Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring boardMIYASAKA MASAHIRO·Filed 2010·Granted Jun 12, 2012·7 cites·13 claims
- 0369US12378376B2Optically softening resin composition, method for producing softened product of optically softening resin composition, curable resin composition and cured product of same, and patterned film and method for producing sameSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Aug 5, 2025·0 cites·6 claims
- 0464US2023332026A1Photocurable composition, cured product of same, photofusible resin composition and adhesive setSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 0563US8105759B2Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the compositionMIYASAKA MASAHIRO·Filed 2006·Granted Jan 31, 2012·2 cites·2 claims
- 0663US7993809B2Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2006·Granted Aug 9, 2011·1 cites·10 claims
- 0763US2023235205A1Adhesive set, film, bonded body, and method for separating adherendSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 0862US2023374276A1CompositionSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 0960US7491789B2Disulfide-containing phenolic resin as curing agent for epoxy resinHITACHI CHEMICAL CO LTD·Filed 2007·Granted Feb 17, 2009·0 cites·1 claims
- 1059US6515036B2Method of decomposing a polyurethaneMITSUI TAKEDA CHEMICALS INC·Filed 2001·Granted Feb 4, 2003·3 cites·4 claims
- 1158US8501392B2Photosensitive element, method for formation of resist pattern, and method for production of print circuit boardSAITOU MANABU·Filed 2007·Granted Aug 6, 2013·2 cites·10 claims
- 1257US4602361AApparatus for playing back rotating recording mediumsVICTOR COMPANY OF JAPAN·Filed 1984·Granted Jul 22, 1986·9 cites·5 claims
- 1355US6660236B1Apparatus for decomposition and recovery of polyurethane resinTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1999·Granted Dec 9, 2003·16 cites·9 claims
- 1453US11888265B2Shielded connector having a first metal member with a contacting portion contacting a second and a third metal memberJAPAN AVIATION ELECTRONICS IND LTD·Filed 2022·Granted Jan 30, 2024·0 cites·9 claims
- 1548US4400808ARotary recording medium reproducing apparatusVICTOR COMPANY OF JAPAN·Filed 1981·Granted Aug 23, 1983·6 cites·6 claims
- 1648US4395744ADisc-shaped recording medium reproducing apparatusVICTOR COMPANY OF JAPAN·Filed 1981·Granted Jul 26, 1983·6 cites·8 claims
- 1744US7504471B2Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesiveHITACHI CHEMICAL CO LTD·Filed 2002·Granted Mar 17, 2009·0 cites·2 claims
- 1843US2010233627A1Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panelHITACHI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 1942US7622243B2Photosensitive element, resist pattern formation method and printed wiring board production methodHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 24, 2009·1 cites·19 claims
- 2042US6489373B2Method for decomposition and recovery of polyurethane resinMITSUI TAKEDA CHEMICALS INC·Filed 1999·Granted Dec 3, 2002·6 cites·4 claims
- 2140US8192916B2Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring boardMIYASAKA MASAHIRO·Filed 2010·Granted Jun 5, 2012·0 cites·16 claims
- 2236US6667416B2Method and apparatus for producing polyester polyol, polyester polyol and polyurethane foamMITSUI TAKEDA CHEMICALS INC·Filed 2001·Granted Dec 23, 2003·0 cites·6 claims
- 2336US2006155096A1Thermoplastic polymer, thermoplastic polymer composition, antistatic agent, and resin compositionMATSUMOTO SHINSUKE·Filed 2003·Application pending·0 cites
- 2434US4410973ARotary recording medium reproducing apparatus having a switch mechanism for detecting return of a jacket opening enlarging mechanismVICTOR COMPANY OF JAPAN·Filed 1981·Granted Oct 18, 1983·2 cites·4 claims
- 2531US4489409ASignal pickup device for disc reproducersVICTOR COMPANY OF JAPAN·Filed 1982·Granted Dec 18, 1984·1 cites·8 claims
- 2631US4410972ARotary recording medium reproducing apparatus having a jacket opening enlarging deviceVICTOR COMPANY OF JAPAN·Filed 1981·Granted Oct 18, 1983·1 cites·8 claims
- 2730US4416004ARotary recording medium reproducing apparatus having a lid member guiding mechanismVICTOR COMPANY OF JAPAN·Filed 1981·Granted Nov 15, 1983·0 cites·5 claims
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