Inventor · disambiguated record
Mitsutoshi Yahagi
Also filed as: YAHAGI MITSUTOSHI
22 granted patents·3 pending applications·109 citations·filing 2007–2023
94Inventor score
Files withEBARA CORP25
Top patents by PatentIndex Score
25 records- 0191US11833551B2Pre-wet module, deaerated liquid circulation system, and pre-wet methodEBARA CORP·Filed 2022·Granted Dec 5, 2023·2 cites·14 claims
- 0289US10830834B2Current measuring module using inspection substrate and inspection substrateEBARA CORP·Filed 2019·Granted Nov 10, 2020·2 cites·5 claims
- 0377USD706224SElectrical contact for use in a plating apparatusEBARA CORP·Filed 2013·Granted Jun 3, 2014·18 cites·1 claims
- 0476US9708724B2Anode unit and plating apparatus having such anode unitEBARA CORP·Filed 2015·Granted Jul 18, 2017·1 cites·13 claims
- 0575US10316425B2Substrate holder, plating apparatus, and plating methodEBARA CORP·Filed 2015·Granted Jun 11, 2019·1 cites·9 claims
- 0674US10513795B2Plating apparatus, plating method, and substrate holderEBARA CORP·Filed 2019·Granted Dec 24, 2019·1 cites·9 claims
- 0771US12076760B2Pre-wet module, deaerated liquid circulation system, and pre-wet methodEBARA CORP·Filed 2023·Granted Sep 3, 2024·0 cites·4 claims
- 0870US10316426B2Plating apparatus, plating method, and substrate holderEBARA CORP·Filed 2016·Granted Jun 11, 2019·1 cites·8 claims
- 0969USD717736SElectrical contact for use in a plating apparatusEBARA CORP·Filed 2014·Granted Nov 18, 2014·12 cites·1 claims
- 1068USD758973SElectrical contact for use in a plating apparatusEBARA CORP·Filed 2015·Granted Jun 14, 2016·9 cites·1 claims
- 1167USD725600SElectrical contact for use in a plating apparatusEBARA CORP·Filed 2014·Granted Mar 31, 2015·10 cites·1 claims
- 1267USD556692SElectrical contact for use in a plating apparatusEBARA CORP·Filed 2007·Granted Dec 4, 2007·15 cites·1 claims
- 1365USD719101SElectrical contact for use in a plating apparatusEBARA CORP·Filed 2014·Granted Dec 9, 2014·10 cites·1 claims
- 1463US2021198800A1Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatusEBARA CORP·Filed 2021·Application pending·0 cites
- 1562US10982347B2Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatusEBARA CORP·Filed 2019·Granted Apr 20, 2021·0 cites·5 claims
- 1662USD742329SElectrical contact for use in a plating apparatusEBARA CORP·Filed 2015·Granted Nov 3, 2015·7 cites·1 claims
- 1759US7897024B2Conducting belt for use with anode holder and anode holderEBARA CORP·Filed 2008·Granted Mar 1, 2011·1 cites·25 claims
- 1859USD555595SElectrical contact for use in a plating apparatusEBARA CORP·Filed 2007·Granted Nov 20, 2007·11 cites·1 claims
- 1956US10458036B2Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatusEBARA CORP·Filed 2017·Granted Oct 29, 2019·0 cites·13 claims
- 2055USD705280SSealing ringEBARA CORP·Filed 2013·Granted May 20, 2014·8 cites·1 claims
- 2154US2025038014A1Pre-wet moduleEBARA CORP·Filed 2022·Application pending·0 cites
- 2253US2014360865A1Copper electroplating apparatusEBARA CORP·Filed 2014·Application pending·0 cites
- 2350US10106906B2Plating apparatusEBARA CORP·Filed 2016·Granted Oct 23, 2018·0 cites·13 claims
- 2440US10240247B2Anode holder and plating apparatusEBARA CORP·Filed 2015·Granted Mar 26, 2019·0 cites·5 claims
- 2536US10214830B2Substrate holder and plating apparatusEBARA CORP·Filed 2015·Granted Feb 26, 2019·0 cites·28 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →