Inventor · disambiguated record
Yusuke Igarashi
Also filed as: IGARASHI YUSUKE
47 granted patents·16 pending applications·551 citations·filing 1993–2012
98Inventor score
Files withSANYO ELECTRIC CO37KANTO SANYO SEMICONDUCTORS CO8USUI RYOSUKE4IGARASHI YUSUKE1KANTO SANYO SEMICONDUCTOR CO L1
Top patents by PatentIndex Score
63 records- 0192US6462418B2Semiconductor device having improved heat radiationSANYO ELECTRIC CO·Filed 2001·Granted Oct 8, 2002·63 cites·7 claims
- 0290US6706547B2Method of manufacturing a circuit device with trenches in a conductive foilSANYO ELECTRIC CO·Filed 2001·Granted Mar 16, 2004·47 cites·21 claims
- 0389US7329957B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Feb 12, 2008·20 cites·5 claims
- 0488US7315083B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Jan 1, 2008·16 cites·9 claims
- 0588US7221049B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted May 22, 2007·17 cites·9 claims
- 0685US7186921B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Mar 6, 2007·13 cites·2 claims
- 0782US6909178B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2003·Granted Jun 21, 2005·27 cites·16 claims
- 0880US7936569B2Circuit device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2006·Granted May 3, 2011·10 cites·10 claims
- 0979US9024446B2Element mounting substrate and semiconductor moduleUSUI RYOSUKE·Filed 2010·Granted May 5, 2015·6 cites·6 claims
- 1079US6531370B2Method for manufacturing circuit devicesSANYO ELECTRIC CO·Filed 2001·Granted Mar 11, 2003·27 cites·32 claims
- 1178US7301228B2Semiconductor device, method for manufacturing same and thin plate interconnect line memberSANYO ELECTRIC CO·Filed 2003·Granted Nov 27, 2007·21 cites·9 claims
- 1278US6812410B2Semiconductor module and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2001·Granted Nov 2, 2004·21 cites·17 claims
- 1377US7364941B2Circuit device manufacturing methodSANYO ELECTRIC CO·Filed 2005·Granted Apr 29, 2008·6 cites·9 claims
- 1474US8115316B2Packaging board, semiconductor module, and portable apparatusKOHARA YASUHIRO·Filed 2007·Granted Feb 14, 2012·6 cites·16 claims
- 1574US7768132B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Aug 3, 2010·7 cites·8 claims
- 1674US6635956B2Semiconductor device, semiconductor module and hard diskSANYO ELECTRIC CO·Filed 2002·Granted Oct 21, 2003·18 cites·4 claims
- 1773US6720209B2Method for fabricating a circuit deviceSANYO ELECTRIC CO·Filed 2002·Granted Apr 13, 2004·19 cites·17 claims
- 1871US7714232B2Circuit device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2005·Granted May 11, 2010·6 cites·4 claims
- 1971US6664138B2Method for fabricating a circuit deviceSANYO ELECTRIC CO·Filed 2002·Granted Dec 16, 2003·17 cites·16 claims
- 2070US8436250B2Metal core circuit element mounting boardTAKAHASHI KOUJI·Filed 2007·Granted May 7, 2013·7 cites·4 claims
- 2170US6791199B2Heat radiating semiconductor deviceSANYO ELECTRIC CO·Filed 2001·Granted Sep 14, 2004·16 cites·28 claims
- 2269US6501162B2Semiconductor device, semiconductor module and hard diskSANYO ELECTRIC CO·Filed 2001·Granted Dec 31, 2002·13 cites·36 claims
- 2367US6646331B2Semiconductor device and semiconductor moduleSANYO ELECTRIC CO·Filed 2001·Granted Nov 11, 2003·10 cites·34 claims
- 2465US7163846B2Method for manufacturing circuit devicesSANYO ELECTRIC CO·Filed 2003·Granted Jan 16, 2007·13 cites·10 claims
- 2563US6953712B2Circuit device manufacturing methodKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Oct 11, 2005·9 cites·13 claims
- 2663US6933604B2Semiconductor device, semiconductor module and hard diskSANYO ELECTRIC CO·Filed 2001·Granted Aug 23, 2005·11 cites·7 claims
- 2763US6883231B2Method for fabricating a circuit deviceSANYO ELECTRIC CO·Filed 2002·Granted Apr 26, 2005·11 cites·18 claims
- 2863US6864121B2Method of manufacturing circuit deviceSANYO ELECTRIC CO·Filed 2001·Granted Mar 8, 2005·9 cites·27 claims
- 2962US6596564B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2002·Granted Jul 22, 2003·8 cites·2 claims
- 3061US7030033B2Method for manufacturing circuit devicesKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Apr 18, 2006·9 cites·25 claims
- 3159US7854062B2Method for manufacturing circuit deviceSANYO ELECTRIC CO·Filed 2009·Granted Dec 21, 2010·1 cites·9 claims
- 3257US7565738B2Method for manufacturing circuit deviceSANYO ELECTRIC CO·Filed 2005·Granted Jul 28, 2009·1 cites·9 claims
- 3357US6949470B2Method for manufacturing circuit devicesKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Sep 27, 2005·7 cites·9 claims
- 3456US6889428B2Method of manufacturing sheet material and method of manufacturing circuit device using the sameSANYO ELECTRIC CO·Filed 2003·Granted May 10, 2005·6 cites·22 claims
- 3555US6967401B2Semiconductor device, semiconductor module and hard diskSANYO ELECTRIC CO·Filed 2001·Granted Nov 22, 2005·6 cites·16 claims
- 3655US6936927B2Circuit device having a multi-layer conductive pathSANYO ELECTRIC CO·Filed 2002·Granted Aug 30, 2005·6 cites·8 claims
- 3754US6780676B2Method for fabricating a circuit deviceSANYO ELECTRIC CO·Filed 2002·Granted Aug 24, 2004·5 cites·18 claims
- 3853US6894375B2Semiconductor device, semiconductor module and hard diskSANYO ELECTRIC CO·Filed 2003·Granted May 17, 2005·1 cites·4 claims
- 3952US5469131AHybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 1993·Granted Nov 21, 1995·20 cites·18 claims
- 4051US2011241203A1Semiconductor module, method for manufacturing semiconductor module, and portable apparatusNAKASATO MAYUMI·Filed 2009·Application pending·0 cites
- 4149US6963126B2Semiconductor device with under-fill material below a surface of a semiconductor chipSANYO ELECTRIC CO·Filed 2001·Granted Nov 8, 2005·3 cites·16 claims
- 4248US7141509B2Method for fabricating a circuit deviceSANYO ELECTRIC CO·Filed 2004·Granted Nov 28, 2006·2 cites·20 claims
- 4347US7105384B2Circuit device manufacturing method including mounting circuit elements on a conductive foil, forming separation grooves in the foil, and etching the rear of the foilKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Sep 12, 2006·2 cites·13 claims
- 4447US7045393B2Method for manufacturing circuit devicesKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted May 16, 2006·2 cites·19 claims
- 4547US6946724B2Circuit device and method of manufacture thereofKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Sep 20, 2005·3 cites·12 claims
- 4646US2005206014A1Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO LTD A OSAKA·Filed 2005·Application pending·0 cites
- 4745US2009194322A1Device mounting board and manufacturing method therefor, and semiconductor moduleUSUI RYOSUKE·Filed 2009·Application pending·0 cites
- 4844US2006012028A1Device mounting boardUSUI RYOSUKE·Filed 2005·Application pending·0 cites
- 4943US6989291B2Method for manufacturing circuit devicesKANTO SANYO SEMICONDUCTOR CO L·Filed 2003·Granted Jan 24, 2006·3 cites·16 claims
- 5043US2006065421A1Circuit device and manufacturing method thereofKANTO SANYO SEMICONDUCTORS CO·Filed 2005·Application pending·0 cites
Showing the top 50 of 63 patent records by PatentIndex Score.
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