Inventor · disambiguated record
David J. Corisis
Also filed as: CORISIS DAVID · CORISIS DAVID J
312 granted patents·23 pending applications·10,991 citations·filing 1995–2022
99Inventor score
Top patents by PatentIndex Score
335 records- 0199US7692931B2Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 6, 2010·108 cites·38 claims
- 0299US6900528B2Stacked mass storage flash memory packageMICRON TECHNOLOGY INC·Filed 2001·Granted May 31, 2005·229 cites·21 claims
- 0399US6607937B1Stacked microelectronic dies and methods for stacking microelectronic diesMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 19, 2003·287 cites·49 claims
- 0499US6294839B1Apparatus and methods of packaging and testing dieMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 25, 2001·352 cites·16 claims
- 0599US6259153B1Transverse hybrid LOC packageMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 10, 2001·210 cites·14 claims
- 0699US6229202B1Semiconductor package having downset leadframe for reducing package bowMICRON TECHNOLOGY INC·Filed 2000·Granted May 8, 2001·299 cites·30 claims
- 0799US6184465B1Semiconductor packageMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 6, 2001·502 cites·6 claims
- 0899US6072233AStackable ball grid array packageMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 6, 2000·579 cites·54 claims
- 0998US9362208B2Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor componentsMICRON TECHNOLOGY INC·Filed 2015·Granted Jun 7, 2016·19 cites·22 claims
- 1098US8148807B2Packaged microelectronic devices and associated systemsLEE CHOON KUAN·Filed 2010·Granted Apr 3, 2012·69 cites·15 claims
- 1198US8106491B2Methods of forming stacked semiconductor devices with a leadframe and associated assembliesCORISIS DAVID J·Filed 2007·Granted Jan 31, 2012·66 cites·19 claims
- 1298US7671459B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devicesMICRON TECHNOLOGIES INC·Filed 2006·Granted Mar 2, 2010·161 cites·11 claims
- 1398US6462273B1Semiconductor card and method of fabricationMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 8, 2002·171 cites·50 claims
- 1498US6314639B1Chip scale package with heat spreader and method of manufactureMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 13, 2001·160 cites·13 claims
- 1598US6303984B1Lead frame including angle iron tie barMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 16, 2001·181 cites·23 claims
- 1698US6297960B1Heat sink with alignment and retaining featuresMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·155 cites·34 claims
- 1798US6297548B1Stackable ceramic FBGA for high thermal applicationsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·259 cites·46 claims
- 1898US6258624B1Semiconductor package having downset leadframe for reducing package bowMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 10, 2001·230 cites·20 claims
- 1998US6103547AHigh speed IC package configurationMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 15, 2000·268 cites·35 claims
- 2098US6089920AModular die sockets with flexible interconnects for packaging bare semiconductor dieMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 18, 2000·205 cites·44 claims
- 2197US8450839B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devicesCORISIS DAVID J·Filed 2010·Granted May 28, 2013·36 cites·8 claims
- 2297US7745920B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted Jun 29, 2010·48 cites·16 claims
- 2397US7704794B2Method of forming a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 27, 2010·43 cites·54 claims
- 2497US7425758B2Metal core foldover package structuresMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 16, 2008·61 cites·53 claims
- 2597US6284571B1Lead frame assemblies with voltage reference plane and IC packages including sameMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 4, 2001·190 cites·27 claims
- 2697US6271580B1Leads under chip in conventional IC packageMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 7, 2001·145 cites·33 claims
- 2797US6246108B1Integrated circuit package including lead frame with electrically isolated alignment featureMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 12, 2001·273 cites·20 claims
- 2897US6140154AMulti-part lead frame with dissimilar materials and method of manufacturingMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 31, 2000·152 cites·15 claims
- 2997US6130474ALeads under chip IC packageMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 10, 2000·152 cites·20 claims
- 3097US6072228AMulti-part lead frame with dissimilar materials and method of manufacturingMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 6, 2000·201 cites·73 claims
- 3197US6048744AIntegrated circuit package alignment featureMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 11, 2000·275 cites·6 claims
- 3296US7262506B2Stacked mass storage flash memory packageMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 28, 2007·85 cites·88 claims
- 3396US6740546B2Packaged microelectronic devices and methods for assembling microelectronic devicesMICRON TECHNOLOGY INC·Filed 2002·Granted May 25, 2004·93 cites·48 claims
- 3496US6329220B1Packages for semiconductor dieMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 11, 2001·161 cites·17 claims
- 3596US6163956AMethod of making chip scale package with heat spreadeMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 26, 2000·91 cites·14 claims
- 3696US6046496AChip packageMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 4, 2000·169 cites·35 claims
- 3795US7888185B2Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 15, 2011·43 cites·22 claims
- 3895US7767913B2Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 3, 2010·33 cites·28 claims
- 3995US7485969B2Stacked microelectronic devices and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·37 cites·41 claims
- 4095US6778404B1Stackable ball grid arrayMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 17, 2004·75 cites·30 claims
- 4195US6760224B2Heat sink with alignment and retaining featuresMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 6, 2004·60 cites·19 claims
- 4295US6563217B2Module assembly for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2002·Granted May 13, 2003·76 cites·26 claims
- 4395US6326687B1IC package with dual heat spreadersMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 4, 2001·148 cites·106 claims
- 4495US6268649B1Stackable ball grid array packageMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 31, 2001·73 cites·51 claims
- 4595US6210992B1Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 3, 2001·172 cites·18 claims
- 4695US6133622AHigh speed IC package configurationMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 17, 2000·140 cites·9 claims
- 4794US6329222B1Interconnect for packaging semiconductor dice and fabricating BGA packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 11, 2001·144 cites·23 claims
- 4894US6232666B1Interconnect for packaging semiconductor dice and fabricating BGA packagesMCIRON TECHNOLOGY INC·Filed 1998·Granted May 15, 2001·202 cites·30 claims
- 4994US6215177B1Tape under frame for conventional-type IC package assemblyMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 10, 2001·49 cites·60 claims
- 5094US6150710ATransverse hybrid LOC packageMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 21, 2000·104 cites·14 claims
Showing the top 50 of 335 patent records by PatentIndex Score.
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