Inventor · disambiguated record
Yasuaki Tsuchiya
Also filed as: TSUCHIYA YASUAKI
28 granted patents·9 pending applications·460 citations·filing 1997–2021
97Inventor score
Top patents by PatentIndex Score
37 records- 0194US6530968B2Chemical mechanical polishing slurryNEC ELECTRONICS CORP·Filed 2001·Granted Mar 11, 2003·109 cites·19 claims
- 0291US6436811B1Method of forming a copper-containing metal interconnect using a chemical mechanical planarization (CMP) slurryNEC CORP·Filed 2000·Granted Aug 20, 2002·60 cites·10 claims
- 0390US6585568B2Chemical mechanical polishing slurryNEC ELECTRONICS CORP·Filed 2001·Granted Jul 1, 2003·54 cites·8 claims
- 0481US6225217B1Method of manufacturing semiconductor device having multilayer wiringNEC CORP·Filed 1999·Granted May 1, 2001·52 cites·10 claims
- 0580US6428405B1Abrasive pad and polishing methodNEC CORP·Filed 2000·Granted Aug 6, 2002·24 cites·7 claims
- 0679US9275935B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Mar 1, 2016·4 cites·14 claims
- 0775US6443807B1Polishing process for use in method of fabricating semiconductor deviceNEC CORP·Filed 2000·Granted Sep 3, 2002·18 cites·28 claims
- 0874US9779992B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 3, 2017·2 cites·20 claims
- 0973US6585786B2Slurry for chemical mechanical polishingNEC ELECTRONICS CORP·Filed 2001·Granted Jul 1, 2003·16 cites·18 claims
- 1069US6478834B2Slurry for chemical mechanical polishingNEC CORP·Filed 2001·Granted Nov 12, 2002·13 cites·17 claims
- 1168US6368981B1Method of manufacturing semiconductor device and chemical mechanical polishing apparatusNEC CORP·Filed 2000·Granted Apr 9, 2002·12 cites·18 claims
- 1266US6723626B2Method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2002·Granted Apr 20, 2004·10 cites·23 claims
- 1365US8512540B2Plating process and manufacturing process for semiconductor device therebyFURUYA AKIRA·Filed 2011·Granted Aug 20, 2013·1 cites·16 claims
- 1458US6831014B2Method of manufacturing a semiconductor apparatus using chemical mechanical polishingNEC ELECTRONICS CORP·Filed 2002·Granted Dec 14, 2004·6 cites·25 claims
- 1556US7091123B2Method of forming metal wiring line including using a first insulating film as a stopper filmNEC ELECTRONICS CORP·Filed 2002·Granted Aug 15, 2006·6 cites·39 claims
- 1655US7067427B2Manufacturing method of semiconductor deviceNEC ELECTRONICS CORP·Filed 2003·Granted Jun 27, 2006·5 cites·8 claims
- 1754US7229570B2Slurry for chemical mechanical polishingNEC ELECTRONICS CORP·Filed 2003·Granted Jun 12, 2007·4 cites·8 claims
- 1853US7955980B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Jun 7, 2011·0 cites·7 claims
- 1953US6930037B2Process for forming a metal interconnectNEC ELECTRONICS CORP·Filed 2000·Granted Aug 16, 2005·6 cites·23 claims
- 2053US6140225AMethod of manufacturing semiconductor device having multilayer wiringNEC CORP·Filed 1998·Granted Oct 31, 2000·15 cites·9 claims
- 2150US7601640B2Method of manfacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted Oct 13, 2009·0 cites·9 claims
- 2249US6235071B1Chemical mechanical polishing method for highly accurate in-plane uniformity in polishing rate over positionNEC CORP·Filed 1999·Granted May 22, 2001·14 cites·6 claims
- 2349US2006237319A1Planting process and manufacturing process for semiconductor device thereby, and plating apparatusFURUYA AKIRA·Filed 2006·Application pending·0 cites
- 2448US6951512B2Chemical mechanical polishing apparatus and method of chemical mechanical polishingNEC ELECTRONICS CORP·Filed 2004·Granted Oct 4, 2005·1 cites·15 claims
- 2547US2023097408A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 2644US6184120B1Method of forming a buried plug and an interconnectionNEC CORP·Filed 1997·Granted Feb 6, 2001·11 cites·10 claims
- 2743US8329584B2Method of manufacturing semiconductor deviceTAKEWAKI TOSHIYUKI·Filed 2011·Granted Dec 11, 2012·0 cites·14 claims
- 2839US6783446B1Chemical mechanical polishing apparatus and method of chemical mechanical polishingNEC ELECTRONICS CORP·Filed 1999·Granted Aug 31, 2004·6 cites·19 claims
- 2938US2004216389A1Chemical mechanical polishing slurryNEC ELECTRONICS CORP·Filed 2004·Application pending·0 cites
- 3038US2001006031A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
- 3137US5959359ASemiconductor device with a copper wiring patternNEC CORP·Filed 1997·Granted Sep 28, 1999·6 cites·12 claims
- 3237US2004020135A1Slurry for polishing copper-based metalNEC ELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 3335US6350186B1Apparatus and method for chemical mechanical polishingNEC CORP·Filed 1999·Granted Feb 26, 2002·5 cites·20 claims
- 3434US2001006224A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
- 3534US2001005009A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
- 3633US2001018270A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
- 3733US2001006225A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
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