Inventor · disambiguated record
Hidekazu Sawai
Also filed as: SAWAI HIDEKAZU
5 granted patents·56 citations·filing 1994–2002
80Inventor score
Files withMITSUBISHI ELECTRIC CORP5
Top patents by PatentIndex Score
5 records- 0159US5585015ALaser machining apparatus and methodMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Dec 17, 1996·20 cites·11 claims
- 0258US6420676B2Method for machining wiring board with laser beam and device for sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 16, 2002·6 cites·3 claims
- 0358US5897800ALaser beam machine based on optically scanning systemMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Apr 27, 1999·20 cites·10 claims
- 0444US6750425B2Three-dimensional laser beam machineMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jun 15, 2004·7 cites·6 claims
- 0532US6201213B1Method and device for machining a wiring board utilizing light shielding of a laser beam to select a machined taperingMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 13, 2001·3 cites·1 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →