Inventor · disambiguated record
Ravindranath V. Mahajan
Also filed as: MAHAJAN RAVINDRANATH · MAHAJAN RAVINDRANATH V · MAHAJAN RAVINDRANATH VITHAL
84 granted patents·73 pending applications·302 citations·filing 1997–2025
99Inventor score
Files withINTEL CORP148SWAMINATHAN RAJASEKARAN3MAHAJAN RAVINDRANATH V2ALEKSOV ALEKSANDAR1GOMES WILFRED1
Top patents by PatentIndex Score
157 records- 0198US11581235B2IC package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2021·Granted Feb 14, 2023·4 cites·20 claims
- 0298US9275955B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2013·Granted Mar 1, 2016·49 cites·17 claims
- 0397US11824018B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2022·Granted Nov 21, 2023·3 cites·20 claims
- 0497US11749577B2IC package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2022·Granted Sep 5, 2023·2 cites·20 claims
- 0597US11742261B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2022·Granted Aug 29, 2023·2 cites·20 claims
- 0697US9679843B2Localized high density substrate routingINTEL CORP·Filed 2016·Granted Jun 13, 2017·17 cites·20 claims
- 0796US12148742B2Active bridge enabled co-packaged photonic transceiverINTEL CORP·Filed 2020·Granted Nov 19, 2024·6 cites·15 claims
- 0896US11011448B2IC package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2019·Granted May 18, 2021·9 cites·18 claims
- 0996US10236209B2Passive components in vias in a stacked integrated circuit packageINTEL CORP·Filed 2014·Granted Mar 19, 2019·22 cites·19 claims
- 1095US8313958B2Magnetic microelectronic device attachmentSWAMINATHAN RAJASEKARAN·Filed 2010·Granted Nov 20, 2012·28 cites·23 claims
- 1194US10366951B2Localized high density substrate routingINTEL CORP·Filed 2017·Granted Jul 30, 2019·7 cites·20 claims
- 1294US8609532B2Magnetically sintered conductive viaSWAMINATHAN RAJASEKARAN·Filed 2010·Granted Dec 17, 2013·22 cites·21 claims
- 1393US11557541B2Interconnect architecture with silicon interposer and EMIBINTEL CORP·Filed 2018·Granted Jan 17, 2023·6 cites·25 claims
- 1493US10068852B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2017·Granted Sep 4, 2018·8 cites·19 claims
- 1593US9691711B2Method of making an electromagnetic interference shield for semiconductor chip packagesINTEL CORP·Filed 2016·Granted Jun 27, 2017·9 cites·18 claims
- 1692US12392970B2Photonic integrated circuit packaging architecturesINTEL CORP·Filed 2021·Granted Aug 19, 2025·2 cites·20 claims
- 1792US12238892B2Immersion cooling for integrated circuit devicesINTEL CORP·Filed 2020·Granted Feb 25, 2025·3 cites·15 claims
- 1892US10373893B2Embedded bridge with through-silicon viasINTEL CORP·Filed 2017·Granted Aug 6, 2019·9 cites·16 claims
- 1990US12061371B2Patch on interposer architecture for low cost optical co-packagingINTEL CORP·Filed 2020·Granted Aug 13, 2024·2 cites·25 claims
- 2090US9716067B2Integrated circuit package with embedded bridgeINTEL CORP·Filed 2016·Granted Jul 25, 2017·6 cites·6 claims
- 2190US2025323114A1Ic package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2025·Application pending·0 cites
- 2289US2025087548A1Ic package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2024·Application pending·0 cites
- 2388US11894359B2Distributed semiconductor die and package architectureINTEL CORP·Filed 2022·Granted Feb 6, 2024·1 cites·23 claims
- 2488US11049798B2Embedded bridge with through-silicon ViasINTEL CORP·Filed 2019·Granted Jun 29, 2021·4 cites·20 claims
- 2585US12243806B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 2685US12199048B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 2785US11694959B2Multi-die ultrafine pitch patch architecture and method of makingINTEL CORP·Filed 2019·Granted Jul 4, 2023·3 cites·25 claims
- 2885US2025046680A1Embedded bridge with through-silicon viasINTEL CORP·Filed 2024·Application pending·0 cites
- 2984US12272656B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 3084US12142545B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 3184US11735533B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2019·Granted Aug 22, 2023·2 cites·22 claims
- 3283US12224103B2Angled inductor with small form factorINTEL CORP·Filed 2021·Granted Feb 11, 2025·1 cites·9 claims
- 3383US12183649B2IC package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 3483US9323327B2System and method for providing tactile feedbackINTEL CORP·Filed 2012·Granted Apr 26, 2016·7 cites·20 claims
- 3583US2025372578A1Semiconductor package having passive support waferINTEL CORP·Filed 2025·Application pending·0 cites
- 3681US12347783B2Interconnect architecture with silicon interposer and EMIBINTEL CORP·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 3781US12206410B2Programmable logic device with fine-grained disaggregationINTEL CORP·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 3881US10601426B1Programmable logic device with fine-grained disaggregationINTEL CORP·Filed 2018·Granted Mar 24, 2020·2 cites·21 claims
- 3981US2025201734A1Heterogeneous nested interposer package for ic chipsINTEL CORP·Filed 2025·Application pending·0 cites
- 4080US11257804B2Distributed semiconductor die and package architectureINTEL CORP·Filed 2020·Granted Feb 22, 2022·1 cites·12 claims
- 4180US9685421B2Methods for high precision microelectronic die integrationINTEL CORP·Filed 2015·Granted Jun 20, 2017·3 cites·17 claims
- 4280US2025060531A1Photonic integrated circuit packaging architectureINTEL CORP·Filed 2024·Application pending·0 cites
- 4379US12159813B2Embedded bridge die with through-silicon viasINTEL CORP·Filed 2023·Granted Dec 3, 2024·0 cites·18 claims
- 4479US2025174523A1Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2025·Application pending·0 cites
- 4579US2025029929A1Multi-die ultrafine pitch patch architecture and method of makingINTEL CORP·Filed 2024·Application pending·0 cites
- 4678US12142568B2Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of makingINTEL CORP·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 4778US11901299B2Interconnect architecture with silicon interposer and EMIBINTEL CORP·Filed 2022·Granted Feb 13, 2024·0 cites·25 claims
- 4878US10468331B2Heat management systemINTEL CORP·Filed 2018·Granted Nov 5, 2019·3 cites·25 claims
- 4977US11328968B2Stacked die cavity packageINTEL CORP·Filed 2016·Granted May 10, 2022·2 cites·18 claims
- 5077US2025118647A1Nested interposer with through-silicon via bridge dieINTEL CORP·Filed 2024·Application pending·0 cites
Showing the top 50 of 157 patent records by PatentIndex Score.
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