Inventor · disambiguated record
Friedjof Heuck
Also filed as: HEUCK FRIEDJOF
15 granted patents·4 pending applications·10 citations·filing 2013–2023
85Inventor score
Top patents by PatentIndex Score
19 records- 0185US11486782B2Micromechanical device and method for manufacturing a micromechanical deviceBOSCH GMBH ROBERT·Filed 2018·Granted Nov 1, 2022·4 cites·9 claims
- 0274US11060937B2Micromechanical pressure sensorBOSCH GMBH ROBERT·Filed 2018·Granted Jul 13, 2021·2 cites·9 claims
- 0374US9428378B2Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a componentBOSCH GMBH ROBERT·Filed 2015·Granted Aug 30, 2016·3 cites·9 claims
- 0466US10126224B2Particle sensor and method for manufacturing a particle sensorBOSCH GMBH ROBERT·Filed 2013·Granted Nov 13, 2018·1 cites·20 claims
- 0554US10753742B2Micromechanical yaw rate sensor and method for operating sameBOSCH GMBH ROBERT·Filed 2016·Granted Aug 25, 2020·0 cites·10 claims
- 0653US12448280B2Bond structures on MEMS element and ASIC elementBOSCH GMBH ROBERT·Filed 2019·Granted Oct 21, 2025·0 cites·15 claims
- 0753US10753743B2Micromechanical yaw rate sensor and method for the production thereofBOSCH GMBH ROBERT·Filed 2016·Granted Aug 25, 2020·0 cites·11 claims
- 0852US12404170B2Method for producing a bonding pad for a micromechanical sensor elementBOSCH GMBH ROBERT·Filed 2023·Granted Sep 2, 2025·0 cites·14 claims
- 0948US12030773B2Method for producing a wafer connectionBOSCH GMBH ROBERT·Filed 2019·Granted Jul 9, 2024·0 cites·16 claims
- 1047US9593012B2Method for producing a micromechanical component, and corresponding micromechanical componentBOSCH GMBH ROBERT·Filed 2014·Granted Mar 14, 2017·0 cites·18 claims
- 1145US11560302B2Micromechanical pressure sensor with two cavities and diaphragms and corresponding production methodBOSCH GMBH ROBERT·Filed 2018·Granted Jan 24, 2023·0 cites·9 claims
- 1245US10217926B2Method for producing a multi-layer electrode systemBOSCH GMBH ROBERT·Filed 2014·Granted Feb 26, 2019·0 cites·11 claims
- 1345US9233841B2Production process for a micromechanical component and micromechanical componentBOSCH GMBH ROBERT·Filed 2013·Granted Jan 12, 2016·0 cites·13 claims
- 1441US12160215B2Method for manufacturing a piezoelectric resonatorBOSCH GMBH ROBERT·Filed 2022·Granted Dec 3, 2024·0 cites·14 claims
- 1540US10012828B2Assembly body for micromirror chips, mirror device and production method for a mirror deviceBOSCH GMBH ROBERT·Filed 2015·Granted Jul 3, 2018·0 cites·10 claims
- 1640US2014355094A1Micromechanical structure and coresponding manufacturing methodSCHORR NICOLAS·Filed 2014·Application pending·0 cites
- 1735US2016138666A1Micromechanical spring for an inertial sensorBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
- 1833US2017081177A1Interposer for mounting a vertically integrated hybrid component on a component carrierBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
- 1933US2015353345A1Vertical Hybrid Integrated MEMS ASIC Component Having A Stress Decoupling StructureBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →