Inventor · disambiguated record
Kuo-Chuan Liu
Also filed as: LIU KUO-CHUAN
33 granted patents·3 pending applications·491 citations·filing 1996–2022
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD17FUJITSU LTD6TAIWAN SEMICONDUCTOR MFG5LIU KUO-CHUAN2NAGAR MOHAN R2
Top patents by PatentIndex Score
36 records- 0198US8941248B2Semiconductor device package and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·70 cites·20 claims
- 0297US9664707B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·9 cites·20 claims
- 0397US9453877B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 27, 2016·9 cites·20 claims
- 0497US9341671B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·14 cites·20 claims
- 0596US10067181B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 4, 2018·5 cites·20 claims
- 0696US6800169B2Method for joining conductive structures and an electrical conductive articleFUJITSU LTD·Filed 2002·Granted Oct 5, 2004·107 cites·18 claims
- 0795US9520385B1Package structure and method for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 13, 2016·11 cites·20 claims
- 0894US10698026B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·3 cites·20 claims
- 0992US11340291B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 1091US10685920B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 16, 2020·5 cites·20 claims
- 1191US8901732B2Semiconductor device package and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·12 cites·20 claims
- 1290US5963417AElectrochemical capacitorWISCONSIN ALUMNI RES FOUND·Filed 1996·Granted Oct 5, 1999·119 cites·21 claims
- 1389US9831190B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 28, 2017·7 cites·20 claims
- 1489US9502323B2Method of forming encapsulated semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·6 cites·20 claims
- 1589US6884313B2Method and system for joining and an ultra-high density interconnectFUJITSU LTD·Filed 2001·Granted Apr 26, 2005·56 cites·17 claims
- 1688US9780076B2Package-on-package structure with through molding viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 3, 2017·4 cites·20 claims
- 1787US9237647B2Package-on-package structure with through molding viaTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·6 cites·20 claims
- 1886US10163862B2Package structure and method for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·4 cites·20 claims
- 1982US11579190B2Testing holders for chip unit and die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 14, 2023·0 cites·20 claims
- 2078US11764169B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 2177US7224857B2Optical-routing boards for opto-electrical systems and methods and apparatuses for manufacturing the sameFUJITSU LTD·Filed 2004·Granted May 29, 2007·17 cites·22 claims
- 2276US8736044B2Lid for an electrical hardware componentAHMAD MUDASIR·Filed 2010·Granted May 27, 2014·4 cites·16 claims
- 2375US9543284B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 10, 2017·2 cites·20 claims
- 2475US6885789B2Optical switch fabricated by a thin film processFUJITSU LTD·Filed 2002·Granted Apr 26, 2005·15 cites·15 claims
- 2572US11329006B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 2663US9252076B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 2, 2016·1 cites·19 claims
- 2759US8962388B2Method and apparatus for supporting a computer chip on a printed circuit board assemblyNAGAR MOHAN R·Filed 2011·Granted Feb 24, 2015·1 cites·10 claims
- 2858US10008480B2Package-on-package structure with through molding viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 26, 2018·0 cites·20 claims
- 2955US9502387B2Package-on-package structure with through molding viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 22, 2016·0 cites·20 claims
- 3049US7083869B2Methods of forming LaNiO3 conductive layers, ferro-electric devices with LaNiO3 layers, and precursor formation solutionsFUJITSU LTD·Filed 2004·Granted Aug 1, 2006·2 cites·9 claims
- 3147US2015173177A1Method and apparatus for supporting a computer chip on a printed circuit board assemblyCISCO TECH INC·Filed 2015·Application pending·0 cites
- 3246US8081484B2Method and apparatus for supporting a computer chip on a printed circuit board assemblyNAGAR MOHAN R·Filed 2006·Granted Dec 20, 2011·0 cites·13 claims
- 3344US7261918B2Methods of forming lanthanum-modified lead zirconium titanate (PLZT) layersFUJITSU LTD·Filed 2004·Granted Aug 28, 2007·0 cites·34 claims
- 3439US2002119396A1Structure and method for forming z-laminated multilayered packaging substrateFiled 2001·Application pending·0 cites
- 3534US2012317886A1Cover moduleLIU KUO-CHUAN·Filed 2012·Application pending·0 cites
- 3626US8453167B2Locking mechanism and an optical disk drive having the sameLIU KUO-CHUAN·Filed 2011·Granted May 28, 2013·0 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →