Inventor · disambiguated record
Adonis Fung
Also filed as: FUNG ADONIS
5 granted patents·32 citations·filing 2009–2014
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0188US7858443B2Leadless integrated circuit package having standoff contacts and die attach padUTAC HONG KONG LTD·Filed 2009·Granted Dec 28, 2010·19 cites·9 claims
- 0281US8736037B2Leadless integrated circuit package having standoff contacts and die attach padPOWELL KIRK·Filed 2010·Granted May 27, 2014·8 cites·20 claims
- 0373US9305889B2Leadless integrated circuit package having standoff contacts and die attach padUTAC HONG KONG LTD·Filed 2014·Granted Apr 5, 2016·3 cites·10 claims
- 0466US8828801B2Leadless array plastic package with various IC packaging configurationsUTAC HONG KONG LTD·Filed 2013·Granted Sep 9, 2014·2 cites·20 claims
- 0536US8486762B2Leadless array plastic package with various IC packaging configurationsMCMILLAN JOHN·Filed 2010·Granted Jul 16, 2013·0 cites·32 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →