Inventor · disambiguated record
Arun Virupaksha Gowda
Also filed as: GOWDA ARUN · GOWDA ARUN V · GOWDA ARUN VIRUPAKSHA
64 granted patents·16 pending applications·456 citations·filing 2003–2023
98Inventor score
Files withGEN ELECTRIC56GOWDA ARUN VIRUPAKSHA6GE AVIATION SYSTEMS LLC4MCCONNELEE PAUL ALAN4BEAUPRE RICHARD ALFRED2
Top patents by PatentIndex Score
80 records- 0197US10163773B1Electronics package having a self-aligning interconnect assembly and method of making sameGEN ELECTRIC·Filed 2017·Granted Dec 25, 2018·16 cites·19 claims
- 0297US8114712B1Method for fabricating a semiconductor device packageMCCONNELEE PAUL ALAN·Filed 2010·Granted Feb 14, 2012·36 cites·22 claims
- 0397US7021147B1Sensor package and methodGEN ELECTRIC·Filed 2005·Granted Apr 4, 2006·64 cites·23 claims
- 0496US8987876B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2013·Granted Mar 24, 2015·20 cites·42 claims
- 0595US9209151B2Embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2013·Granted Dec 8, 2015·19 cites·28 claims
- 0695US7297399B2Thermal transport structure and associated methodGEN ELECTRIC·Filed 2005·Granted Nov 20, 2007·52 cites·24 claims
- 0794US9953913B1Electronics package with embedded through-connect structure and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Apr 24, 2018·10 cites·27 claims
- 0894US9953917B1Electronics package with embedded through-connect and resistor structure and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Apr 24, 2018·11 cites·34 claims
- 0994US9704788B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2015·Granted Jul 11, 2017·9 cites·30 claims
- 1094US8653635B2Power overlay structure with leadframe connectionsGOWDA ARUN VIRUPAKSHA·Filed 2011·Granted Feb 18, 2014·15 cites·14 claims
- 1193US10186477B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2016·Granted Jan 22, 2019·8 cites·20 claims
- 1293US9391027B2Embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2015·Granted Jul 12, 2016·9 cites·19 claims
- 1393US8358000B2Double side cooled power module with power overlayGEN ELECTRIC·Filed 2009·Granted Jan 22, 2013·48 cites·23 claims
- 1492US7797808B2Thermal management system and associated methodGEN ELECTRIC·Filed 2005·Granted Sep 21, 2010·16 cites·21 claims
- 1591US8334593B2Semiconductor device packageMCCONNELEE PAUL ALAN·Filed 2012·Granted Dec 18, 2012·12 cites·14 claims
- 1690US10269688B2Power overlay structure and method of making sameGEN ELECTRIC·Filed 2013·Granted Apr 23, 2019·9 cites·21 claims
- 1790US8716870B2Direct write interconnections and method of manufacturing thereofGOWDA ARUN VIRUPAKSHA·Filed 2011·Granted May 6, 2014·13 cites·22 claims
- 1889US8941208B2Reliable surface mount integrated power moduleCHAUHAN SHAKTI SINGH·Filed 2012·Granted Jan 27, 2015·10 cites·24 claims
- 1988US9966361B1Electronics package having a multi-thickness conductor layer and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted May 8, 2018·5 cites·24 claims
- 2087US9299630B2Diffusion barrier for surface mount modulesGOWDA ARUN VIRUPAKSHA·Filed 2012·Granted Mar 29, 2016·10 cites·23 claims
- 2186US9966371B1Electronics package having a multi-thickness conductor layer and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted May 8, 2018·4 cites·21 claims
- 2283US8487416B2Coaxial power moduleDELGADO ELADIO CLEMENTE·Filed 2011·Granted Jul 16, 2013·7 cites·18 claims
- 2382US7605466B2Sealed wafer packaging of microelectromechanical systemsGEN ELECTRIC·Filed 2007·Granted Oct 20, 2009·10 cites·17 claims
- 2481US9806051B2Ultra-thin embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2014·Granted Oct 31, 2017·4 cites·17 claims
- 2580US10700035B2Stacked electronics package and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Jun 30, 2020·3 cites·32 claims
- 2680US10068879B2Three-dimensional stacked integrated circuit devices and methods of assembling the sameGEN ELECTRIC·Filed 2016·Granted Sep 4, 2018·3 cites·20 claims
- 2778US9171785B2Power overlay structure with leadframe connectionsGEN ELECTRIC·Filed 2014·Granted Oct 27, 2015·3 cites·12 claims
- 2877US9613843B2Power overlay structure having wirebonds and method of manufacturing sameGEN ELECTRIC·Filed 2014·Granted Apr 4, 2017·3 cites·25 claims
- 2977US8310040B2Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereofBEAUPRE RICHARD ALFRED·Filed 2010·Granted Nov 13, 2012·4 cites·11 claims
- 3076US10453786B2Power electronics package and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Oct 22, 2019·2 cites·16 claims
- 3175US8586421B2Method of forming semiconductor device package having high breakdown voltage and low parasitic inductanceBEAUPRE RICHARD ALFRED·Filed 2012·Granted Nov 19, 2013·3 cites·20 claims
- 3272US10770444B2Electronics package having a multi-thickness conductor layer and method of manufacturing thereofGEN ELECTRIC·Filed 2018·Granted Sep 8, 2020·1 cites·28 claims
- 3371US9184124B2Reliable surface mount integrated power moduleGEN ELECTRIC·Filed 2014·Granted Nov 10, 2015·2 cites·21 claims
- 3470US9117813B2Integrated circuit package and method of making sameMCCONNELEE PAUL ALAN·Filed 2012·Granted Aug 25, 2015·2 cites·6 claims
- 3570US8531027B2Press-pack module with power overlay interconnectionGOWDA ARUN VIRUPAKSHA·Filed 2010·Granted Sep 10, 2013·3 cites·19 claims
- 3670US7919714B2System and a method for controlling flow of solderGEN ELECTRIC·Filed 2007·Granted Apr 5, 2011·2 cites·12 claims
- 3768US9066443B2Overlay circuit structure for interconnecting light emitting semiconductorsGOWDA ARUN VIRUPAKSHA·Filed 2011·Granted Jun 23, 2015·2 cites·26 claims
- 3867US12444938B2Power distribution circuits for electrically powered aircraftWISK AERO LLC·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 3966US11605609B2Ultra-thin embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2020·Granted Mar 14, 2023·0 cites·26 claims
- 4066US10312194B2Stacked electronics package and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Jun 4, 2019·1 cites·24 claims
- 4162US12034033B2Semiconductor device package and method of formingGE AVIATION SYSTEMS LLC·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 4262US10607929B2Electronics package having a self-aligning interconnect assembly and method of making sameGEN ELECTRIC·Filed 2018·Granted Mar 31, 2020·0 cites·20 claims
- 4362US9570376B2Electrical interconnect for an integrated circuit package and method of making sameGEN ELECTRIC·Filed 2015·Granted Feb 14, 2017·1 cites·20 claims
- 4462US8916996B2Electrical distribution systemAIMI MARCO FRANCESCO·Filed 2011·Granted Dec 23, 2014·1 cites·20 claims
- 4562US8054589B2Switch structure and associated circuitGEN ELECTRIC·Filed 2009·Granted Nov 8, 2011·3 cites·20 claims
- 4661US12322916B2Electronic connection assemblyGE AVIATION SYSTEMS LLC·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 4761US9252138B2Interconnect devices for electronic packaging assembliesGEN ELECTRIC·Filed 2014·Granted Feb 2, 2016·0 cites·16 claims
- 4860US10607957B2Ultra-thin embedded semiconductor device package and method of manufacturing thereofGEN ELECTRIC·Filed 2017·Granted Mar 31, 2020·0 cites·15 claims
- 4958USRE48015EInterconnect devices for electronic packaging assembliesGEN ELECTRIC·Filed 2018·Granted May 26, 2020·0 cites·26 claims
- 5058US10141203B2Electrical interconnect structure for an embedded electronics packageGEN ELECTRIC·Filed 2017·Granted Nov 27, 2018·0 cites·20 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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