Inventor · disambiguated record
Shawn X. Arnold
Also filed as: ARNOLD SHAWN · ARNOLD SHAWN X · ARNOLD SHAWN XAVIER
38 granted patents·11 pending applications·369 citations·filing 2007–2024
97Inventor score
Top patents by PatentIndex Score
49 records- 0199US9030440B2Capacitive sensor packagingAPPLE INC·Filed 2013·Granted May 12, 2015·69 cites·33 claims
- 0298US9135495B1Capacitive sensor packagingAPPLE INC·Filed 2015·Granted Sep 15, 2015·37 cites·20 claims
- 0397US9576178B2Capacitive sensor packagingAPPLE INC·Filed 2016·Granted Feb 21, 2017·20 cites·21 claims
- 0497US9268989B2Capacitive sensor packagingAPPLE INC·Filed 2015·Granted Feb 23, 2016·20 cites·24 claims
- 0597US9001081B2Capacitive sensor packagingAPPLE INC·Filed 2014·Granted Apr 7, 2015·30 cites·30 claims
- 0695US9763329B1Techniques for observing an entire communication bus in operationAPPLE INC·Filed 2016·Granted Sep 12, 2017·61 cites·20 claims
- 0795US8941013B2Multilayer laminated structure for plug and connector with spring finger interconnecting featureARNOLD SHAWN X·Filed 2012·Granted Jan 27, 2015·23 cites·23 claims
- 0893US9196958B2Antenna structures and shield layers on packaged wireless circuitsARNOLD SHAWN XAVIER·Filed 2012·Granted Nov 24, 2015·39 cites·29 claims
- 0993US8736080B2Sensor array packageAPPLE INC·Filed 2012·Granted May 27, 2014·12 cites·23 claims
- 1088US8664656B1Devices and methods for embedding semiconductors in printed circuit boardsAPPLE INC·Filed 2012·Granted Mar 4, 2014·8 cites·12 claims
- 1187US9593991B2Printed circuits with embedded strain gaugesAPPLE INC·Filed 2015·Granted Mar 14, 2017·5 cites·20 claims
- 1286US10007833B2Capacitive sensor packagingAPPLE INC·Filed 2017·Granted Jun 26, 2018·2 cites·22 claims
- 1385US10007832B2Capacitive sensor packagingAPPLE INC·Filed 2016·Granted Jun 26, 2018·2 cites·21 claims
- 1484US9402316B2Methods for forming a sensor array packageAPPLE INC·Filed 2015·Granted Jul 26, 2016·3 cites·18 claims
- 1583US9936579B2Low profile packaging and assembly of a power conversion system in modular formAPPLE INC·Filed 2014·Granted Apr 3, 2018·5 cites·20 claims
- 1681US10423815B2Capacitive sensor packagingAPPLE INC·Filed 2018·Granted Sep 24, 2019·1 cites·20 claims
- 1781US9030841B2Low profile, space efficient circuit shieldsARNOLD SHAWN X·Filed 2012·Granted May 12, 2015·7 cites·10 claims
- 1880US9190379B2Perimeter trench sensor array packageAPPLE INC·Filed 2012·Granted Nov 17, 2015·5 cites·20 claims
- 1979US10932366B2Low profile packaging and assembly of a power conversion system in modular formAPPLE INC·Filed 2018·Granted Feb 23, 2021·2 cites·20 claims
- 2077US9443830B1Printed circuits with embedded semiconductor diesAPPLE INC·Filed 2015·Granted Sep 13, 2016·3 cites·16 claims
- 2174US10455707B1Connection pad for embedded components in PCB packagingAPPLE INC·Filed 2018·Granted Oct 22, 2019·3 cites·23 claims
- 2274US10179254B2Capacitor structure with acoustic noise self-canceling characteristicsAPPLE INC·Filed 2016·Granted Jan 15, 2019·1 cites·15 claims
- 2374US9018091B2Methods for forming a sensor array packageAPPLE INC·Filed 2014·Granted Apr 28, 2015·2 cites·21 claims
- 2473US9455539B1Connector having printed circuit with embedded dieAPPLE INC·Filed 2015·Granted Sep 27, 2016·2 cites·19 claims
- 2569US9330943B2Low cost repackaging of thinned integrated devicesAPPLE INC·Filed 2013·Granted May 3, 2016·2 cites·14 claims
- 2666US10783347B2Capacitive sensor packagingAPPLE INC·Filed 2019·Granted Sep 22, 2020·0 cites·20 claims
- 2766US9805867B2Acoustically quiet capacitorsAPPLE INC·Filed 2013·Granted Oct 31, 2017·1 cites·13 claims
- 2866US9287049B2Low acoustic noise capacitorsAPPLE INC·Filed 2013·Granted Mar 15, 2016·1 cites·20 claims
- 2964US8767408B2Three dimensional passive multi-component structuresARNOLD SHAWN X·Filed 2012·Granted Jul 1, 2014·2 cites·19 claims
- 3061US9215807B2Small form factor stacked electrical passive devices that reduce the distance to the ground planeARNOLD SHAWN X·Filed 2012·Granted Dec 15, 2015·1 cites·20 claims
- 3159US2015310991A1Multi-layered ceramic capacitorsAPPLE INC·Filed 2014·Application pending·0 cites
- 3258US2018144870A1Multi-layered ceramic capacitorsAPPLE INC·Filed 2018·Application pending·0 cites
- 3355US8809859B2Devices and methods for embedding semiconductors in printed circuit boardsAPPLE INC·Filed 2014·Granted Aug 19, 2014·0 cites·20 claims
- 3452US2025071888A1Damping structureAPPLE INC·Filed 2024·Application pending·0 cites
- 3551US9664747B2Electronic devices with magnetic sensorsAPPLE INC·Filed 2013·Granted May 30, 2017·0 cites·15 claims
- 3649US2015364253A1Heel fillet capacitor with noise reductionAPPLE INC·Filed 2014·Application pending·0 cites
- 3748US2008047135A1Rigid flex printed circuit boardCHIPSTACK INC·Filed 2007·Application pending·0 cites
- 3847US9053952B2Silicon shapingAPPLE INC·Filed 2012·Granted Jun 9, 2015·0 cites·17 claims
- 3946US9117873B2Direct multiple substrate die assemblyAPPLE INC·Filed 2012·Granted Aug 25, 2015·0 cites·9 claims
- 4046US8942002B2Three dimensional passive multi-component structuresARNOLD SHAWN X·Filed 2012·Granted Jan 27, 2015·0 cites·14 claims
- 4146US2014008110A1Pcb manufacturing process and structureARNOLD SHAWN X·Filed 2012·Application pending·0 cites
- 4245US9812401B2Techniques for observing an entire communication bus in operationAPPLE INC·Filed 2016·Granted Nov 7, 2017·0 cites·20 claims
- 4344US9715964B2Ceramic capacitors with built-in EMI shieldAPPLE INC·Filed 2014·Granted Jul 25, 2017·0 cites·18 claims
- 4444US2009109636A1Multiple package module using a rigid flex printed circuit boardCHIPSTACK INC·Filed 2008·Application pending·0 cites
- 4541US2013277856A1Method for stabilizing embedded siliconARNOLD SHAWN X·Filed 2012·Application pending·0 cites
- 4640US2014038357A1Singulated ic stiffener and de-bond processARNOLD SHAWN X·Filed 2012·Application pending·0 cites
- 4737US10420213B2Segmented via for vertical PCB interconnectAPPLE INC·Filed 2017·Granted Sep 17, 2019·0 cites·20 claims
- 4837US2018061578A1Stacked passive component structuresAPPLE INC·Filed 2017·Application pending·0 cites
- 4936US2017083042A1Surface shaping of device packages to mitigate fractures under bending stressAPPLE INC·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →