Inventor
LIN CHIH-WEN
TW27 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHIH-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MACRONIX INT CO LTD
15 patentsUS6650008B2Nov 18, 2003
Stacked semiconductor packaging device
MACRONIX INT CO LTD54 citations95
US7521783B2Apr 21, 2009
Ultra thin image sensor package structure and method for fabrication
MACRONIX INT CO LTD21 citations92
US7227253B2Jun 5, 2007
Ultra thin dual chip image sensor package structure and method for fabrication
MACRONIX INT CO LTD16 citations92
US7217995B2May 15, 2007
Apparatus for stacking electrical components using insulated and interconnecting via
MACRONIX INT CO LTD20 citations92
US7045888B2May 16, 2006
Ultra thin dual chip image sensor package structure and method for fabrication
MACRONIX INT CO LTD16 citations92
US6972372B1Dec 6, 2005
Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection
MACRONIX INT CO LTD23 citations92
US6559526B2May 6, 2003
Multiple-step inner lead of leadframe
MACRONIX INT CO LTD52 citations92
US7122904B2Oct 17, 2006
Semiconductor packaging device and manufacture thereof
MACRONIX INT CO LTD16 citations83
US7495327B2Feb 24, 2009
Chip stacking structure
MACRONIX INT CO LTD5 citations73
US7462925B2Dec 9, 2008
Method and apparatus for stacking electrical components using via to provide interconnection
MACRONIX INT CO LTD6 citations73
US7102159B2Sep 5, 2006
Ultra thin image sensor package structure and method for fabrication
MACRONIX INT CO LTD8 citations73
US7259042B2Aug 21, 2007
Ultra thin dual chip image sensor package structure and method for fabrication
MACRONIX INT CO LTD4 citations62
US6977436B2Dec 20, 2005
Semiconductor packaging device
MACRONIX INT CO LTD4 citations62
US7892888B2Feb 22, 2011
Method and apparatus for stacking electrical components using via to provide interconnection
MACRONIX INT CO LTD0 citations52
US7291927B2Nov 6, 2007
Dual chips stacked packaging structure
MACRONIX INT CO LTD1 citations52
PRIMAX ELECTRONICS LTD
6 patentsUS11206378B2Dec 21, 2021
Camera module aligning method
PRIMAX ELECTRONICS LTD3 citations71
US11900743B2Feb 13, 2024
Security authentication method and security authentication device using same
PRIMAX ELECTRONICS LTD1 citations61
US11582395B1Feb 14, 2023
Gimbal device
PRIMAX ELECTRONICS LTD0 citations61
US10958817B1Mar 23, 2021
Method for determining camera module assembling quality
PRIMAX ELECTRONICS LTD1 citations61
US12249108B2Mar 11, 2025
3D image sensing device with 3D image processing function and 3D image processing method applied thereto
PRIMAX ELECTRONICS LTD0 citations50
US11509888B1Nov 22, 2022
Method for aligning camera lens with light source
PRIMAX ELECTRONICS LTD0 citations50
FARADAY TECH CORP
4 patentsUS7058557B2Jun 6, 2006
Method for functional verification of hardware design
FARADAY TECH CORP7 citations74
US7047433B2May 16, 2006
Method and circuit for synchronizing a higher frequency clock and a lower frequency clock
FARADAY TECH CORP9 citations74
US7231565B2Jun 12, 2007
Method for performing built-in and at-speed test in system-on-chip
FARADAY TECH CORP6 citations63
US7213187B2May 1, 2007
Digital logic test method to systematically approach functional coverage completely and related apparatus and system
FARADAY TECH CORP2 citations63