Inventor · disambiguated record
Yong Seok Han
Also filed as: HAN YONG · HAN YONG-SEOK
28 granted patents·10 pending applications·76 citations·filing 2004–2024
95Inventor score
Top patents by PatentIndex Score
38 records- 0198US11505740B2Cadmium free quantum dotsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 22, 2022·7 cites·26 claims
- 0295US11845888B2Cadmium free quantum dotsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 19, 2023·1 cites·18 claims
- 0395US11142685B2Cadmium free quantum dotsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 12, 2021·11 cites·31 claims
- 0495US9904109B2Color filter, method of making the same, and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 27, 2018·8 cites·16 claims
- 0594US11981851B2Quantum dots and device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 14, 2024·1 cites·19 claims
- 0692US10126598B2Color filter, method of making the same, and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 13, 2018·4 cites·24 claims
- 0791US11661547B2Quantum dot polymer composites and devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 30, 2023·2 cites·21 claims
- 0891US10324373B2Photosensitive compositions and quantum dot polymer composite patterns including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 18, 2019·3 cites·17 claims
- 0990US11099410B2Layered structures, production methods thereof, and liquid crystal display including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 24, 2021·3 cites·22 claims
- 1090US10723942B2Quantum dot polymer composites and devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 28, 2020·6 cites·22 claims
- 1189US10983432B2Photosensitive compositions, preparation methods thereof, quantum dot polymer composite prepared therefromSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 20, 2021·4 cites·18 claims
- 1289US9921472B2Photosensitive compositions and quantum dot polymer composite patterns including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 20, 2018·5 cites·20 claims
- 1379US11424425B2Electroluminescent device, and display device comprising thereofSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 23, 2022·1 cites·20 claims
- 1477US11935984B2Semiconductor nanocrystal particle, method for preparing same, and device including sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·19 claims
- 1575US11758746B2Electroluminescent device, and display device comprising thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 1673US9772278B2Multi-channel aerosol scattering absorption measuring instrumentNANJING UNIVERSITY·Filed 2014·Granted Sep 26, 2017·3 cites·10 claims
- 1770US11499098B2Quantum dots and device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 15, 2022·0 cites·24 claims
- 1869US11835856B2Photosensitive compositions, preparation methods thereof, quantum dot polymer composite prepared therefromSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·19 claims
- 1969US11563143B2Semiconductor nanocrystal particle, method for preparing same, and device including sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·9 claims
- 2068US11867988B2Layered structures, production methods thereof, and liquid crystal display including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 9, 2024·0 cites·22 claims
- 2168US10678130B2Photosensitive compositions and quantum dot polymer composite patterns including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 9, 2020·0 cites·32 claims
- 2267US7452923B2Anisotropic conductive adhesiveLG CABLE LTD·Filed 2004·Granted Nov 18, 2008·11 cites·8 claims
- 2363USD1075020SBiosignal measuring deviceHHS CO LTD·Filed 2021·Granted May 13, 2025·4 cites·1 claims
- 2463US2024247188A1Semiconductor nanoparticle, production method thereof, and electroluminescent device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2562US2025040296A1Semiconductor nanoparticle, production method thereof, and electroluminescent device and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2661US2022209152A1Luminescent film and device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 2759US2023235220A1Semiconductor nanoparticle, production method thereof, and electroluminescent device and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2855US11566176B2Semiconductor nanocrystal particles and devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 2955US7438834B2Anisotropic conductive adhesive having PTC characteristicsLG CABLE LTD·Filed 2005·Granted Oct 21, 2008·1 cites·12 claims
- 3052US7993417B2Method of adhering a pair of membersLS CABLE LTD·Filed 2007·Granted Aug 9, 2011·1 cites·4 claims
- 3145US2011290538A1Connecting structure and adhesion method of pcb using anisotropic conductive film, and method for evaluating connecting condition using the sameHAN CHUL-JONG·Filed 2011·Application pending·0 cites
- 3244US2012181702A1Photosensitive adhesive composition having alkali soluble epoxy resin, and patternable adhesive film using the sameLEE JAE JUN·Filed 2011·Application pending·0 cites
- 3339US2012175790A1Composition for patternable adhesive film, patternable adhesive film, and method of manufacturing semiconductor package using the sameHAN YONG SEOK·Filed 2011·Application pending·0 cites
- 3437US2011091811A1Double-layered patternable adhesive film, method of forming the same, and method of forming patternable adhesive layer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 3536US8558388B2Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor packagePARK JOON-YONG·Filed 2011·Granted Oct 15, 2013·0 cites·20 claims
- 3634US2012181686A1Method of preparing semiconductor package and semiconductor die for semiconductor packagePARK JOON YONG·Filed 2011·Application pending·0 cites
- 3734US2012135251A1Photosensitive polyimide having silicon modified group, adhesive composition and semiconductor package including the sameJEONG CHUL HO·Filed 2011·Application pending·0 cites
- 3829US11048020B2Method of real-time measuring vertical profiles of multiple atmospheric parameters carried by aerostatHEFEI INST PHYSICAL SCI CAS·Filed 2017·Granted Jun 29, 2021·0 cites·8 claims
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