Inventor · disambiguated record
Hiroshi Kawashimo
Also filed as: KAWASHIMO HIROSHI
4 granted patents·152 citations·filing 1987–2001
74Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP4
Top patents by PatentIndex Score
4 records- 0188US6020625ALead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Feb 1, 2000·143 cites·6 claims
- 0231US5207786AWire bonding methodMITSUBISHI ELECTRIC CORP·Filed 1992·Granted May 4, 1993·7 cites·2 claims
- 0330US6530512B2Wire bonding apparatus and wire bonding methodMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Mar 11, 2003·0 cites·6 claims
- 0426US4824801AMethod of manufacturing aluminum bonding pad with PSG coatingMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Apr 25, 1989·2 cites·1 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →