Inventor · disambiguated record
Robert A. Rita
Also filed as: RITA ROBERT A · RITA ROBERT ANTHONY
32 granted patents·2 pending applications·857 citations·filing 1983–2008
98Inventor score
Top patents by PatentIndex Score
34 records- 0198US6072690AHigh k dielectric capacitor with low k sheathed signal viasIBM·Filed 1998·Granted Jun 6, 2000·152 cites·7 claims
- 0296US6178082B1High temperature, conductive thin film diffusion barrier for ceramic/metal systemsIBM·Filed 1998·Granted Jan 23, 2001·129 cites·15 claims
- 0391US6430030B2High k dielectric material with low k dielectric sheathed signal viasIBM·Filed 2001·Granted Aug 6, 2002·34 cites·4 claims
- 0491US6023407AStructure for a thin film multilayer capacitorIBM·Filed 1998·Granted Feb 8, 2000·80 cites·26 claims
- 0588US7186461B2Glass-ceramic materials and electronic packages including sameCAPITAL FORMATION INC·Filed 2005·Granted Mar 6, 2007·11 cites·17 claims
- 0686US5283104AVia paste compositions and use thereof to form conductive vias in circuitized ceramic substratesIBM·Filed 1991·Granted Feb 1, 1994·80 cites·31 claims
- 0782US6791133B2Interposer capacitor built on silicon wafer and joined to a ceramic substrateIBM·Filed 2002·Granted Sep 14, 2004·30 cites·17 claims
- 0881US6200400B1Method for making high k dielectric material with low k dielectric sheathed signal viasIBM·Filed 1999·Granted Mar 13, 2001·34 cites·8 claims
- 0979US6216324B1Method for a thin film multilayer capacitorIBM·Filed 1999·Granted Apr 17, 2001·37 cites·36 claims
- 1078US6943108B2Interposer capacitor built on silicon wafer and joined to a ceramic substrateIBM·Filed 2004·Granted Sep 13, 2005·22 cites·18 claims
- 1173US6339527B1Thin film capacitor on ceramicIBM·Filed 1999·Granted Jan 15, 2002·41 cites·20 claims
- 1269US6713686B2Apparatus and method for repairing electronic packagesIBM·Filed 2002·Granted Mar 30, 2004·16 cites·20 claims
- 1369US5337475AProcess for producing ceramic circuit structures having conductive viasIBM·Filed 1992·Granted Aug 16, 1994·37 cites·16 claims
- 1464US7387838B2Low loss glass-ceramic materials, method of making same and electronic packages including sameCAPITAL FORMATION INC·Filed 2005·Granted Jun 17, 2008·2 cites·11 claims
- 1564US6461493B1Decoupling capacitor method and structure using metal based carrierIBM·Filed 1999·Granted Oct 8, 2002·23 cites·20 claims
- 1664US6436332B1Low loss glass ceramic composition with modifiable dielectric constantIBM·Filed 2000·Granted Aug 20, 2002·5 cites·8 claims
- 1764US6117367APastes for improved substrate dimensional controlIBM·Filed 1998·Granted Sep 12, 2000·22 cites·10 claims
- 1862US7294909B2Electronic package repair processIBM·Filed 2005·Granted Nov 13, 2007·2 cites·14 claims
- 1959US6285080B1Planar metallized substrate with embedded camber control material and method thereofIBM·Filed 1998·Granted Sep 4, 2001·21 cites·22 claims
- 2053US6210545B1Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite targetIBM·Filed 1999·Granted Apr 3, 2001·15 cites·17 claims
- 2151US6171988B1Low loss glass ceramic composition with modifiable dielectric constantIBM·Filed 1999·Granted Jan 9, 2001·11 cites·4 claims
- 2251US2008245467A1Low loss glass-ceramic materials, method of making same and electronic packages including sameCAPITAL FORMATION INC·Filed 2008·Application pending·0 cites
- 2350US7608295B2Polyimide compositions and use thereof in ceramic product defect repairIBM·Filed 2007·Granted Oct 27, 2009·0 cites·8 claims
- 2447US6823585B2Method of selective plating on a substrateIBM·Filed 2003·Granted Nov 30, 2004·2 cites·13 claims
- 2544US6916670B2Electronic package repair processIBM·Filed 2003·Granted Jul 12, 2005·1 cites·25 claims
- 2644US5655209AMultilayer ceramic substrates having internal capacitor, and process for producing sameIBM·Filed 1995·Granted Aug 5, 1997·12 cites·11 claims
- 2742US6413339B1Low temperature sintering of ferrite materialsIBM·Filed 1999·Granted Jul 2, 2002·7 cites·29 claims
- 2839US6231707B1Method of forming a multilayer ceramic substrate with max-punched viasIBM·Filed 1998·Granted May 15, 2001·8 cites·5 claims
- 2939US2004132900A1Polyimide compositions and use thereof in ceramic product defect repairIBM·Filed 2003·Application pending·0 cites
- 3038US6475555B2Process for screening features on an electronic substrate with a low viscosity pasteIBM·Filed 1999·Granted Nov 5, 2002·7 cites·6 claims
- 3137US5489465AEdge seal technology for low dielectric/porous substrate processingIBM·Filed 1994·Granted Feb 6, 1996·6 cites·13 claims
- 3232US6254925B1Source metal embedded in an inert material and process thereofIBM·Filed 1998·Granted Jul 3, 2001·2 cites·20 claims
- 3332US5948193AProcess for fabricating a multilayer ceramic substrate from thin greensheetIBM·Filed 1997·Granted Sep 7, 1999·6 cites·5 claims
- 3431US4478947AGas panel seal glassIBM·Filed 1983·Granted Oct 23, 1984·2 cites·7 claims
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