Inventor · disambiguated record
Tomotaka Tabuchi
Also filed as: TABUCHI TOMOTAKA
10 granted patents·1 pending application·33 citations·filing 2002–2020
82Inventor score
Files withDISCO CORP11
Top patents by PatentIndex Score
11 records- 0186US11056346B2Wafer processing methodDISCO CORP·Filed 2020·Granted Jul 6, 2021·2 cites·3 claims
- 0279US9330976B2Wafer processing methodDISCO CORP·Filed 2015·Granted May 3, 2016·4 cites·3 claims
- 0379US6852608B2Production method for semiconductor chipDISCO CORP·Filed 2002·Granted Feb 8, 2005·25 cites·15 claims
- 0463US10115636B2Processing method for workpieceDISCO CORP·Filed 2015·Granted Oct 30, 2018·1 cites·3 claims
- 0563US9123797B2Resin powder wafer processing utilizing a frame with a plurality of partitionsDISCO CORP·Filed 2014·Granted Sep 1, 2015·1 cites·3 claims
- 0657US12304027B2Grinding apparatus and use method of grinding apparatusDISCO CORP·Filed 2020·Granted May 20, 2025·0 cites·3 claims
- 0746US9112019B2Wafer processing utilizing a frame with a plurality of partitionsDISCO CORP·Filed 2014·Granted Aug 18, 2015·0 cites·1 claims
- 0840US10468303B2Device chip manufacturing methodDISCO CORP·Filed 2018·Granted Nov 5, 2019·0 cites·7 claims
- 0938US2018330957A1Workpiece processing methodDISCO CORP·Filed 2018·Application pending·0 cites
- 1035US10354919B2Wafer dividing methodDISCO CORP·Filed 2016·Granted Jul 16, 2019·0 cites·3 claims
- 1128US10692721B2Wafer processing method for reforming protective filmDISCO CORP·Filed 2017·Granted Jun 23, 2020·0 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →