Inventor · disambiguated record
Hee Jin Park
Also filed as: PARK HEE-JIN
27 granted patents·12 pending applications·308 citations·filing 1998–2023
95Inventor score
Files withSAMSUNG ELECTRONICS CO LTD17SAMSUNG SDS CO LTD5MAGNACHIP SEMICONDUCTOR LTD2PARK HEE JIN2SAMSUNG ELECTRO MECH2
Top patents by PatentIndex Score
39 records- 0193US10722605B2Photocatalyst filter and air conditioner including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 28, 2020·4 cites·14 claims
- 0292US7368821B2BGA semiconductor chip package and mounting structure thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 6, 2008·26 cites·20 claims
- 0391US7374079B2Method for providing banking services by use of mobile communication systemLG TELECOM LTD·Filed 2004·Granted May 20, 2008·87 cites·16 claims
- 0488US7885870B2System for providing banking services by use of mobile communicationLG UPLUS CORP·Filed 2004·Granted Feb 8, 2011·58 cites·20 claims
- 0586US11585546B2Photocatalytic filter and air conditioning device comprising photocatalytic filterSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 21, 2023·2 cites·11 claims
- 0684US7629679B2Semiconductor package, memory card including the same, and mold for fabricating the memory cardSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 8, 2009·13 cites·19 claims
- 0784US6857470B2Stacked chip package with heat transfer wiresSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 22, 2005·38 cites·20 claims
- 0883US9878448B2Omnidirectional moving robot device, and system and method for object conveyance using the sameDAEGU GYEONGBUK INST SCIENCE & TECH·Filed 2015·Granted Jan 30, 2018·6 cites·10 claims
- 0977US7485959B2Structure for joining a semiconductor package to a substrate using a solder columnSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 3, 2009·2 cites·14 claims
- 1075US6633519B2Optical pick-up device of disk playerLG ELECTRONICS INC·Filed 2001·Granted Oct 14, 2003·12 cites·19 claims
- 1172US6239487B1Lead frame with heat spreader and semiconductor package therewithHYUNDAI ELECTRONICS IND·Filed 1998·Granted May 29, 2001·53 cites·29 claims
- 1271US11701446B2Photocatalyst filter and air conditioner including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 18, 2023·0 cites·20 claims
- 1366US8223248B2Image sensor module having a semiconductor chip, a holder and a coupling memberLEE SEUNG HYUN·Filed 2009·Granted Jul 17, 2012·4 cites·20 claims
- 1465US10340156B2Heat releasing semiconductor chip package and method for manufacturing the sameMAGNACHIP SEMICONDUCTOR LTD·Filed 2014·Granted Jul 2, 2019·1 cites·12 claims
- 1563US9189105B2Touch sensorSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 17, 2015·1 cites·18 claims
- 1661US9828260B2Softening apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 28, 2017·0 cites·15 claims
- 1757US11289345B2Heat releasing semiconductor chip package and method for manufacturing the sameMAGNACHIP SEMICONDUCTOR LTD·Filed 2019·Granted Mar 29, 2022·0 cites·13 claims
- 1857US2023042284A1Method and apparatus for supporting transactions of productsSAMSUNG SDS CO LTD·Filed 2022·Application pending·0 cites
- 1956US2023151685A1Roman shade curtain having viewing partPARK HEE JIN·Filed 2023·Application pending·0 cites
- 2055US2023038041A1Roman shade curtainPARK HEE JIN·Filed 2022·Application pending·0 cites
- 2153US11800353B2Locking apparatus and control method thereofSAMSUNG SDS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·18 claims
- 2253US11576995B2Method for manufacturing photocatalytic filter for air purificationSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 14, 2023·0 cites·8 claims
- 2353US8321153B2Method for determining isotopic clusters and monoisotopic masses of polypeptides on mass spectra of complex polypeptide mixtures and computer-readable medium thereofPARK KUN SOO·Filed 2007·Granted Nov 27, 2012·1 cites·17 claims
- 2452US11609976B2Method and system for managing image based on interworking face image and messenger accountLINE PLUS CORP·Filed 2019·Granted Mar 21, 2023·0 cites·17 claims
- 2552US10676850B2Washing machine and method for controlling the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 9, 2020·0 cites·20 claims
- 2652US2015090648A1Softening apparatus and washing machine including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2750US11706032B2Method and apparatus for user authenticationSAMSUNG SDS CO LTD·Filed 2019·Granted Jul 18, 2023·0 cites·4 claims
- 2849US2014352413A1Moisture transmission testing instrumentSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2947US2016125402A1Method and device for payment using tokenSAMSUNG SDS CO LTD·Filed 2015·Application pending·0 cites
- 3046US11452994B2Method for producing photocatalyst and photocatalyst filter for air cleaningSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 27, 2022·0 cites·6 claims
- 3145US11496469B2Apparatus and method for registering biometric information, apparatus and method for biometric authenticationSAMSUNG SDS CO LTD·Filed 2020·Granted Nov 8, 2022·0 cites·14 claims
- 3245US2020064271A1Sensor for measuring concentration of object substance by color change, sensing system comprising same, and method for manufacturing same sensorSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 3344US10071917B2Softening apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 11, 2018·0 cites·23 claims
- 3442US2012113181A1Resist ink printing deviceKWON JI HAN·Filed 2011·Application pending·0 cites
- 3542US2009051023A1Stack package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3641US2021161365A1User terminal and control method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 3740US2012024573A1Printed circuit board and manufacturing method thereofKIM JAE HUN·Filed 2011·Application pending·0 cites
- 3837US10400424B2Joystick lever assemblyDAEDONG IND CO LTD·Filed 2017·Granted Sep 3, 2019·0 cites·10 claims
- 3936US2002084519A1Semiconductor chip stack package and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →