Inventor · disambiguated record
Pa-Lan Lee
Also filed as: LEE PA-LAN
4 granted patents·1 pending application·23 citations·filing 2011–2016
73Inventor score
Top patents by PatentIndex Score
5 records- 0185US8436462B2Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structureKIM DONG-HAN·Filed 2011·Granted May 7, 2013·9 cites·14 claims
- 0280US9280182B2Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 8, 2016·5 cites·20 claims
- 0378US9059162B2Chip on film (COF) substrate, COF package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 16, 2015·5 cites·20 claims
- 0475US9437526B2Chip on film package including distributed via plugsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 6, 2016·4 cites·18 claims
- 0548US2016162091A1Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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