Inventor · disambiguated record
Tetsuo Fujii
Also filed as: FUJII TETSUO
126 granted patents·14 pending applications·3,508 citations·filing 1981–2023
99Inventor score
Top patents by PatentIndex Score
140 records- 0199US6550331B2Semiconductor mechanical sensorDENSO CORP·Filed 2001·Granted Apr 22, 2003·108 cites·41 claims
- 0298US7704763B2Highly efficient group-III nitride based light emitting diodes via fabrication of structures on an N-face surfaceUNIV CALIFORNIA·Filed 2003·Granted Apr 27, 2010·170 cites·14 claims
- 0398US6463803B2Semiconductor mechanical sensorNIPPON DENSO CO·Filed 2000·Granted Oct 15, 2002·46 cites·5 claims
- 0498US4774556ANon-volatile semiconductor memory deviceNIPPON DENSO CO·Filed 1986·Granted Sep 27, 1988·186 cites·14 claims
- 0597US5627318AMechanical force sensing semiconductor deviceNIPPON DENSO CO·Filed 1995·Granted May 6, 1997·97 cites·8 claims
- 0696US6227050B1Semiconductor mechanical sensor and method of manufactureDENSO CORP·Filed 1998·Granted May 8, 2001·69 cites·31 claims
- 0796US6171881B1Acceleration sensor and process for the production thereofDENSO CORP·Filed 1999·Granted Jan 9, 2001·80 cites·13 claims
- 0896US5461916AMechanical force sensing semiconductor deviceNIPPON DENSO CO·Filed 1993·Granted Oct 31, 1995·100 cites·8 claims
- 0996US4891984AAcceleration detecting apparatus formed by semiconductorNIPPON DENSO CO·Filed 1986·Granted Jan 9, 1990·117 cites·5 claims
- 1096US4867561AApparatus for optically detecting an extraneous matter on a translucent shieldNIPPON DENSO CO·Filed 1987·Granted Sep 19, 1989·349 cites·34 claims
- 1195US8283738B2Semiconductor device including sensor member and cap member and method of making the sameFUJII TETSUO·Filed 2010·Granted Oct 9, 2012·18 cites·16 claims
- 1295US6429506B1Semiconductor device produced by dicingDENSO CORP·Filed 2000·Granted Aug 6, 2002·82 cites·1 claims
- 1395US5872024AMethod for manufacturing a mechanical force sensing semiconductor deviceNIPPON DENSO CO·Filed 1997·Granted Feb 16, 1999·65 cites·7 claims
- 1494US8497557B2Semiconductor deviceTANAKA MASAYA·Filed 2010·Granted Jul 30, 2013·23 cites·1 claims
- 1594US4975390AMethod of fabricating a semiconductor pressure sensorNIPPON DENSO CO·Filed 1987·Granted Dec 4, 1990·125 cites·14 claims
- 1693US6227049B1Acceleration sensor and process for the production thereofDENSO CORP·Filed 1995·Granted May 8, 2001·62 cites·21 claims
- 1793US5138422ASemiconductor device which includes multiple isolated semiconductor segments on one chipNIPPON DENSO CO·Filed 1991·Granted Aug 11, 1992·192 cites·3 claims
- 1893US4393365AMethod and system for forecasting and warning on automotive abnormalitiesNIPPON DENSO CO·Filed 1981·Granted Jul 12, 1983·77 cites·10 claims
- 1992US8278731B2Semiconductor device having SOI substrate and method for manufacturing the sameSUMITOMO MASAKIYO·Filed 2008·Granted Oct 2, 2012·20 cites·15 claims
- 2092US7821085B2Physical quantity sensor and method for manufacturing the sameDENSO CORP·Filed 2009·Granted Oct 26, 2010·26 cites·12 claims
- 2192US7540199B2Physical quantity sensorDENSO CORP·Filed 2007·Granted Jun 2, 2009·23 cites·31 claims
- 2292US6979873B2Semiconductor device having multiple substratesDENSO CORP·Filed 2004·Granted Dec 27, 2005·57 cites·4 claims
- 2392US6255741B1Semiconductor device with a protective sheet to affix a semiconductor chipDENSO CORP·Filed 1999·Granted Jul 3, 2001·150 cites·36 claims
- 2491US8154073B2Semiconductor deviceAOKI TAKAAKI·Filed 2007·Granted Apr 10, 2012·24 cites·17 claims
- 2591US7040165B2Semiconductor mechanical sensorDENSO CORP·Filed 2005·Granted May 9, 2006·13 cites·2 claims
- 2690US8759926B2Semiconductor physical quantity sensorFUJII TETSUO·Filed 2011·Granted Jun 24, 2014·11 cites·3 claims
- 2790US7859091B2Manufacturing methods for semiconductor device with sealed capDENSO CORP·Filed 2008·Granted Dec 28, 2010·17 cites·25 claims
- 2890US7838331B2Method for dicing semiconductor substrateDENSO CORP·Filed 2006·Granted Nov 23, 2010·16 cites·14 claims
- 2990US6244112B1Acceleration sensor and process for the production thereofDENSO CORP·Filed 1999·Granted Jun 12, 2001·44 cites·16 claims
- 3090US5313836ASemiconductor sensor for accelerometerNIPPON DENSO CO·Filed 1992·Granted May 24, 1994·72 cites·15 claims
- 3189US7968432B2Laser processing apparatus and laser processing methodDENSO CORP·Filed 2006·Granted Jun 28, 2011·12 cites·10 claims
- 3289US7901967B2Dicing method for semiconductor substrateDENSO CORP·Filed 2006·Granted Mar 8, 2011·20 cites·21 claims
- 3389US7511484B2Magnetic sensor and method for detecting magnetic fieldDENSO CORP·Filed 2007·Granted Mar 31, 2009·19 cites·32 claims
- 3489US6584852B2Electrical capacitance pressure sensor having electrode with fixed area and manufacturing method thereofDENSO CORPORTATION·Filed 2002·Granted Jul 1, 2003·49 cites·22 claims
- 3589US4963505ASemiconductor device and method of manufacturing sameNIPPON DENSO CO·Filed 1988·Granted Oct 16, 1990·96 cites·9 claims
- 3688US7891244B2Method of making a physical quantity sensorDENSO CORP·Filed 2009·Granted Feb 22, 2011·12 cites·1 claims
- 3788US7407827B2Semiconductor mechanical sensorDENSO CORP·Filed 2005·Granted Aug 5, 2008·9 cites·9 claims
- 3888USRE34893ESemiconductor pressure sensor and method of manufacturing sameNIPPON DENSO CO·Filed 1993·Granted Apr 4, 1995·81 cites·22 claims
- 3988US5017979AEEPROM semiconductor memory deviceNIPPON DENSO CO·Filed 1989·Granted May 21, 1991·41 cites·7 claims
- 4087US9515067B2Semiconductor device having switching element and free wheel diode and method for controlling the sameDENSO CORP·Filed 2014·Granted Dec 6, 2016·9 cites·38 claims
- 4187US8815701B2Method for manufacturing semiconductor device having SOI substrateSUMITOMO MASAKIYO·Filed 2012·Granted Aug 26, 2014·8 cites·4 claims
- 4287US8587168B2Electric device mounted in electric compressorYAMADA MASAO·Filed 2011·Granted Nov 19, 2013·9 cites·14 claims
- 4386US8455973B2Region divided substrate and semiconductor deviceFUJII TETSUO·Filed 2010·Granted Jun 4, 2013·7 cites·29 claims
- 4486US6868727B2Semiconductor mechanical sensorDENSO CORP·Filed 2003·Granted Mar 22, 2005·7 cites·5 claims
- 4586US5320705AMethod of manufacturing a semiconductor pressure sensorNIPPON DENSO CO·Filed 1993·Granted Jun 14, 1994·55 cites·11 claims
- 4685US7968958B2Semiconductor device and manufacturing method of the sameDENSO CORP·Filed 2008·Granted Jun 28, 2011·9 cites·15 claims
- 4784US5442223ASemiconductor device with stress reliefNIPPON DENSO CO·Filed 1994·Granted Aug 15, 1995·80 cites·12 claims
- 4883US8822263B2Epitaxial growth method of a zinc oxide based semiconductor layer, epitaxial crystal structure, epitaxial crystal growth apparatus, and semiconductor deviceKOUKITU AKINORI·Filed 2009·Granted Sep 2, 2014·9 cites·3 claims
- 4982US8413507B2Semiconductor dynamic quantity sensor and method of manufacturing the sameFUJII TETSUO·Filed 2010·Granted Apr 9, 2013·7 cites·13 claims
- 5081US2023275185A1Highly efficient gallium nitride based light emitting diodes via surface rougheningUNIV CALIFORNIA·Filed 2023·Application pending·0 cites
Showing the top 50 of 140 patent records by PatentIndex Score.
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