Inventor · disambiguated record
Alois Stelzl
Also filed as: STELZL ALOIS
37 granted patents·1 pending application·770 citations·filing 1998–2017
98Inventor score
Top patents by PatentIndex Score
38 records- 0196US8169041B2MEMS package and method for the production thereofPAHL WOLFGANG·Filed 2006·Granted May 1, 2012·41 cites·21 claims
- 0295US8432007B2MEMS package and method for the production thereofLEIDL ANTON·Filed 2011·Granted Apr 30, 2013·24 cites·18 claims
- 0394US6449828B2Method of producing a surface acoustic wave componentSIEMENS MATSUSHITA COMPONENTS·Filed 2001·Granted Sep 17, 2002·68 cites·2 claims
- 0492US8294535B2Electrical component and production methodFEIERTAG GREGOR·Filed 2006·Granted Oct 23, 2012·28 cites·39 claims
- 0592US7518201B2Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said methodEPCOS AG·Filed 2006·Granted Apr 14, 2009·25 cites·6 claims
- 0692US7259041B2Method for the hermetic encapsulation of a componentEPCOS AG·Filed 2002·Granted Aug 21, 2007·77 cites·16 claims
- 0790US9647196B2Wafer-level package and method for production thereofBAUER CHRISTIAN·Filed 2012·Granted May 9, 2017·14 cites·15 claims
- 0888US9853204B2MEMS component and method for encapsulating MEMS componentsSNAPTRACK INC·Filed 2013·Granted Dec 26, 2017·8 cites·19 claims
- 0988US7388281B2Encapsulated electronic component and production methodEPCOS AG·Filed 2003·Granted Jun 17, 2008·62 cites·25 claims
- 1084US6519822B1Method for producing an electronic componentEPCOS AG·Filed 2000·Granted Feb 18, 2003·29 cites·5 claims
- 1182US8865499B2MEMS microphone and method for producing the MEMS microphonePAHL WOLFGANG·Filed 2011·Granted Oct 21, 2014·6 cites·20 claims
- 1282US7544540B2Encapsulated electrical component and production methodEPCOS AG·Filed 2005·Granted Jun 9, 2009·12 cites·18 claims
- 1381US6838739B2Component with a labelEPCOS AG·Filed 2001·Granted Jan 4, 2005·27 cites·13 claims
- 1478US7673386B2Flip-chip component production methodEPCOS AG·Filed 2008·Granted Mar 9, 2010·9 cites·22 claims
- 1577US8404516B2Method for producing a MEMS packageBAUER CHRISTIAN·Filed 2009·Granted Mar 26, 2013·8 cites·18 claims
- 1677US6722030B1Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface wavesEPCOS AG·Filed 1999·Granted Apr 20, 2004·57 cites·14 claims
- 1776US7094626B2Method for encapsulating an electrical componentEPCOS AG·Filed 2002·Granted Aug 22, 2006·15 cites·21 claims
- 1875US6528924B1Electronic component, in particular a component operating with surface acoustic wavesSIEMENS AG·Filed 1998·Granted Mar 4, 2003·47 cites·9 claims
- 1974US6242842B1Electrical component, in particular saw component operating with surface acoustic waves, and a method for its productionSIEMENS MATSUSHITA COMPONENTS·Filed 1998·Granted Jun 5, 2001·23 cites·5 claims
- 2074US6136175AMethod of producing an electronic component, in particular a surface acoustic wave componentSIEMENS AG·Filed 1998·Granted Oct 24, 2000·27 cites·9 claims
- 2173US7608789B2Component arrangement provided with a carrier substrateEPCOS AG·Filed 2004·Granted Oct 27, 2009·15 cites·20 claims
- 2273US7552532B2Method for hermetically encapsulating a componentEPCOS AG·Filed 2002·Granted Jun 30, 2009·17 cites·14 claims
- 2373US6555758B1Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the likeEPCOS AG·Filed 2000·Granted Apr 29, 2003·20 cites·6 claims
- 2472US6909183B2Substrate for an electric component and method for the production thereofEPCOS AG·Filed 2002·Granted Jun 21, 2005·16 cites·7 claims
- 2572US6310420B1Electronic component in particular an saw component operating with surface acoustic waves and a method for its productionSIEMENS AG·Filed 1998·Granted Oct 30, 2001·25 cites·5 claims
- 2669US8580613B2Semiconductor chip arrangement with sensor chip and manufacturing methodFEIERTAG GREGOR·Filed 2009·Granted Nov 12, 2013·4 cites·9 claims
- 2768US6057222AMethod for the production of flip-chip mounting-ready contacts of electrical componentsSIEMENS AG·Filed 1998·Granted May 2, 2000·34 cites·10 claims
- 2867US9006868B2Encapsulation of an MEMS component and a method for producing said componentBAUER CHRISTIAN·Filed 2011·Granted Apr 14, 2015·2 cites·7 claims
- 2967US6685168B1Surface acoustic wave componentEPCOS AG·Filed 1999·Granted Feb 3, 2004·21 cites·7 claims
- 3065US8759677B2Hermetically sealed housing for electronic components and manufacturing methodBAUER CHRISTIAN·Filed 2009·Granted Jun 24, 2014·3 cites·12 claims
- 3165US8110962B2MEMS component and method for productionBAUER CHRISTIAN·Filed 2009·Granted Feb 7, 2012·4 cites·17 claims
- 3254US8691369B2Element with optical marking, manufacturing method, and useSCHMAJEW ALEXANDER·Filed 2008·Granted Apr 8, 2014·2 cites·24 claims
- 3352US10164166B2MEMS component and method for encapsulating MEMS componentsSNAPTRACK INC·Filed 2017·Granted Dec 25, 2018·0 cites·14 claims
- 3443US9382110B2Component and method for producing a componentBAUER CHRISTIAN·Filed 2011·Granted Jul 5, 2016·0 cites·7 claims
- 3541US11245977B2Electric component with sensitive component structures and method for producing an electric component with sensitive component structuresSNAPTRACK INC·Filed 2015·Granted Feb 8, 2022·0 cites·16 claims
- 3639US2014226285A1Component and Method for Producing a ComponentBAUER CHRISTIAN·Filed 2012·Application pending·0 cites
- 3732US9165905B2Method for connecting a plurality of unpackaged substratesKRUEGER HANS·Filed 2011·Granted Oct 20, 2015·0 cites·20 claims
- 3827US9114979B2Method and apparatus for producing chip devices, and chip device produced by means of the methodGERNER MICHAEL·Filed 2011·Granted Aug 25, 2015·0 cites·20 claims
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