Inventor · disambiguated record
Deepukumar M. Nair
Also filed as: NAIR DEEPUKUMAR M
14 granted patents·6 pending applications·98 citations·filing 2001–2024
90Inventor score
Top patents by PatentIndex Score
20 records- 0191US9153863B2Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applicationsDU PONT·Filed 2013·Granted Oct 6, 2015·35 cites·16 claims
- 0291US7586444B2High-frequency electromagnetic bandgap device and method for making sameDELPHI TECH INC·Filed 2006·Granted Sep 8, 2009·25 cites·16 claims
- 0385US8633858B2Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefromNAIR DEEPUKUMAR M·Filed 2011·Granted Jan 21, 2014·16 cites·18 claims
- 0480US11114363B2Electronic package arrangements and related methodsQORVO US INC·Filed 2019·Granted Sep 7, 2021·3 cites·23 claims
- 0578US12327679B2Process for making laminate substrate with sintered componentsQORVO US INC·Filed 2023·Granted Jun 10, 2025·0 cites·20 claims
- 0676US9579748B2Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tapeDU PONT·Filed 2014·Granted Feb 28, 2017·3 cites·13 claims
- 0775US10906274B2Laminate substrate with sintered componentsQORVO US INC·Filed 2019·Granted Feb 2, 2021·0 cites·22 claims
- 0872US11551995B2Substrate with embedded active thermoelectric coolerQORVO US INC·Filed 2018·Granted Jan 10, 2023·2 cites·24 claims
- 0971US8391017B2Thin-film capacitor structures embedded in semiconductor packages and methods of makingMCGREGOR DAVID ROSS·Filed 2010·Granted Mar 5, 2013·5 cites·16 claims
- 1069US10587029B2Multi-layer substrate with integrated resonatorQORVO US INC·Filed 2018·Granted Mar 10, 2020·2 cites·22 claims
- 1163US2025183183A1Sip module with stilted interconnectsQORVO US INC·Filed 2024·Application pending·0 cites
- 1261US11783998B2Process for making laminate substrate with sintered componentsQORVO US INC·Filed 2019·Granted Oct 10, 2023·0 cites·14 claims
- 1354US8742262B2Low temperature co-fired ceramic structure for high frequency applications and process for making sameGORDON SCOTT E·Filed 2012·Granted Jun 3, 2014·2 cites·24 claims
- 1449US6731853B2Multiple fiber chip clampCORNING INCORPORARTED·Filed 2001·Granted May 4, 2004·5 cites·18 claims
- 1549US2014353005A1Method of making microwave and millimeterwave electronic circuits by laser patterning of unfired low temperature co-fired ceramic (ltcc) substratesDU PONT·Filed 2014·Application pending·0 cites
- 1639US7855685B2Microwave communication packageDELPHI TECH INC·Filed 2007·Granted Dec 21, 2010·0 cites·18 claims
- 1738US2010270646A1Thin-film capacitor structures embedded in semiconductor packages and methods of makingGEORGIA TECH RES INST·Filed 2010·Application pending·0 cites
- 1837US2008142911A1Electromagnetic bandgap motion sensor device and method for making sameBERLIN CARL W·Filed 2006·Application pending·0 cites
- 1936US2006226928A1Ball coax interconnectHENNING LARRY C·Filed 2005·Application pending·0 cites
- 2036US2007224737A1Method for creating and tuning Electromagnetic Bandgap structure and deviceBERLIN CARL W·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →