Inventor · disambiguated record
Jung Sup Shim
Also filed as: SHIM JUNG SUP
43 granted patents·3 pending applications·94 citations·filing 2011–2020
97Inventor score
Top patents by PatentIndex Score
46 records- 0198US10202525B2Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the sameLG CHEMICAL LTD·Filed 2014·Granted Feb 12, 2019·11 cites·13 claims
- 0297US10308842B2Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the sameLG CHEMICAL LTD·Filed 2014·Granted Jun 4, 2019·7 cites·11 claims
- 0394US8742411B2Adhesive film and method of encapsulating organic electrode device using the sameLG CHEMICAL LTD·Filed 2013·Granted Jun 3, 2014·13 cites·25 claims
- 0493US10421887B2Adhesive compositionLG CHEMICAL LTD·Filed 2016·Granted Sep 24, 2019·3 cites·12 claims
- 0591US9391293B2Adhesive filmLG CHEMICAL LTD·Filed 2013·Granted Jul 12, 2016·4 cites·22 claims
- 0690US10800953B2Adhesive compositionLG CHEMICAL LTD·Filed 2019·Granted Oct 13, 2020·3 cites·14 claims
- 0790US10622573B2Adhesive and method of encapsulating organic electronic device using the sameLG CHEMICAL LTD·Filed 2018·Granted Apr 14, 2020·1 cites·32 claims
- 0890US10351736B2Adhesive compositionLG CHEMICAL LTD·Filed 2016·Granted Jul 16, 2019·2 cites·12 claims
- 0989US10336919B2Adhesive compositionLG CHEMICAL LTD·Filed 2016·Granted Jul 2, 2019·5 cites·17 claims
- 1089US10050204B2Encapsulation composition (as amended)LG CHEMICAL LTD·Filed 2014·Granted Aug 14, 2018·5 cites·11 claims
- 1189US9548473B2Method of evaluating reliable life span of encapsulant film and device for evaluating reliability of said filmLG CHEMICAL LTD·Filed 2014·Granted Jan 17, 2017·4 cites·12 claims
- 1287US10062855B2Adhesive and method of encapsulating organic electronic device using the sameLG CHEMICAL LTD·Filed 2015·Granted Aug 28, 2018·4 cites·27 claims
- 1387US9806293B2Encapsulation filmLG CHEMICAL LTD·Filed 2014·Granted Oct 31, 2017·6 cites·11 claims
- 1483US11267996B2Adhesive compositionLG CHEMICAL LTD·Filed 2020·Granted Mar 8, 2022·1 cites·14 claims
- 1583US9768386B2Composition for encapsulation film, encapsulation film, and electronic device comprising the sameLG CHEMICAL LTD·Filed 2014·Granted Sep 19, 2017·6 cites·12 claims
- 1680US10435596B2Pressure-sensitive adhesive compositionLG CHEMICAL LTD·Filed 2014·Granted Oct 8, 2019·1 cites·14 claims
- 1780US9966562B2Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing sameLG CHEMICAL LTD·Filed 2014·Granted May 8, 2018·2 cites·20 claims
- 1879US11370942B2Pressure-sensitive adhesive compositionLG CHEMICAL LTD·Filed 2019·Granted Jun 28, 2022·0 cites·15 claims
- 1979US9422460B2Adhesive filmLG CHEMICAL LTD·Filed 2014·Granted Aug 23, 2016·3 cites·11 claims
- 2078US9923169B2Encapsulant filmLG CHEMICAL LTD·Filed 2014·Granted Mar 20, 2018·1 cites·15 claims
- 2176US9698378B2Encapsulation filmLG CHEMICAL LTD·Filed 2014·Granted Jul 4, 2017·2 cites·16 claims
- 2275US10626245B2Adhesive film and sealing product for organic electronic device using sameLG CHEMICAL LTD·Filed 2018·Granted Apr 21, 2020·0 cites·23 claims
- 2374US10141543B2Method for manufacturing electronic deviceLG CHEMICAL LTD·Filed 2014·Granted Nov 27, 2018·2 cites·35 claims
- 2473US10626307B2Adhesive filmLG CHEMICAL LTD·Filed 2018·Granted Apr 21, 2020·0 cites·15 claims
- 2572US11142669B2Adhesive and method of encapsulating organic electronic device using the sameLG CHEMICAL LTD·Filed 2020·Granted Oct 12, 2021·0 cites·31 claims
- 2672US10683440B2Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the sameLG CHEMICAL LTD·Filed 2019·Granted Jun 16, 2020·0 cites·12 claims
- 2771US10752814B2Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the sameLG CHEMICAL LTD·Filed 2018·Granted Aug 25, 2020·0 cites·13 claims
- 2871US9236303B2Substrate film and method of manufacturing the sameLG CHEMICAL LTD·Filed 2013·Granted Jan 12, 2016·2 cites·24 claims
- 2970US11319468B2Adhesive compositionLG CHEMICAL LTD·Filed 2016·Granted May 3, 2022·1 cites·14 claims
- 3070US9577214B2Adhesive film and method of encapsulating organic electronic deviceLG CHEMICAL LTD·Filed 2013·Granted Feb 21, 2017·0 cites·23 claims
- 3169US9905450B2Wafer processing baseKIM SE RA·Filed 2011·Granted Feb 27, 2018·2 cites·9 claims
- 3268US9698379B2Encapsulation filmLG CHEMICAL LTD·Filed 2014·Granted Jul 4, 2017·1 cites·12 claims
- 3368US9105648B2Adhesive and method of encapsulating organic electronic device using the sameLG CHEMICAL LTD·Filed 2014·Granted Aug 11, 2015·1 cites·27 claims
- 3465US11091673B2Organic electronic deviceLG CHEMICAL LTD·Filed 2019·Granted Aug 17, 2021·0 cites·13 claims
- 3563US10227514B2Adhesive filmLG CHEMICAL LTD·Filed 2013·Granted Mar 12, 2019·1 cites·13 claims
- 3661US2015079726A1Method of manufacturing organic electronic deviceLG CHEMICAL LTD·Filed 2014·Application pending·0 cites
- 3760US2014377554A1Pressure-sensitive adhesive compositionLG CHEMICAL LTD·Filed 2014·Application pending·0 cites
- 3859US9343697B2Adhesive film and sealing method for organic electronic device using sameLG CHEMICAL LTD·Filed 2014·Granted May 17, 2016·0 cites·19 claims
- 3958US11267995B2Adhesive compositionLG CHEMICAL LTD·Filed 2016·Granted Mar 8, 2022·0 cites·14 claims
- 4058US10125292B2Adhesive film and product for encapsulating organic electronic device using sameLG CHEMICAL LTD·Filed 2014·Granted Nov 13, 2018·0 cites·18 claims
- 4154US10093785B2Adhesive film and sealing product for organic electronic device using sameLG CHEMICAL LTD·Filed 2014·Granted Oct 9, 2018·0 cites·19 claims
- 4253US10457842B2Curable compositionLG CHEMICAL LTD·Filed 2014·Granted Oct 29, 2019·0 cites·14 claims
- 4350US9343702B2Adhesive film and method for encapsulating organic electronic device using sameLG CHEMICAL LTD·Filed 2015·Granted May 17, 2016·0 cites·15 claims
- 4447US9765232B2Solventless composition and method for preparing the sameLG CHEMICAL LTD·Filed 2013·Granted Sep 19, 2017·0 cites·17 claims
- 4545US9165815B2Wafer processing sheetKIM SE RA·Filed 2011·Granted Oct 20, 2015·0 cites·15 claims
- 4633US2017146702A1Adhesive composition, adhesive film, brightness enhancement film, and backlight unit comprising sameLG CHEMICAL LTD·Filed 2015·Application pending·0 cites
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