Inventor · disambiguated record
Hyo-Geun Chae
Also filed as: CHAE HYO-GEUN
6 granted patents·1 pending application·96 citations·filing 1998–2003
83Inventor score
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0186US6489790B1Socket including pressure conductive rubber and mesh for testing of ball grid array packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Dec 3, 2002·39 cites·20 claims
- 0272US6462534B2Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewithSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Oct 8, 2002·20 cites·16 claims
- 0359US6450839B1Socket, circuit board, and sub-circuit board for semiconductor integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Sep 17, 2002·23 cites·39 claims
- 0455US7017428B2Test kit for semiconductor package and method for testing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 28, 2006·5 cites·25 claims
- 0547US6841425B2Wafer treatment method for protecting fuse box of semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 11, 2005·3 cites·7 claims
- 0638US2002092910A1Method and apparatus for detecting defective markings on a semiconductor productSAMSUNG ELECTRONICS CO LTD·Filed 2001·Application pending·0 cites
- 0735US6396294B2Socket pin and socket for electrical testing of semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted May 28, 2002·6 cites·19 claims
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