Inventor · disambiguated record
Byoung-Jun Min
Also filed as: MIN BYOUNG-JUN
5 granted patents·2 pending applications·54 citations·filing 1998–2016
78Inventor score
Top patents by PatentIndex Score
7 records- 0179US8564317B2Test socket, and test apparatus with test socket to control a temperature of an object to be testedHAN JONG-WON·Filed 2010·Granted Oct 22, 2013·6 cites·13 claims
- 0272US6462534B2Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewithSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Oct 8, 2002·20 cites·16 claims
- 0359US6450839B1Socket, circuit board, and sub-circuit board for semiconductor integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Sep 17, 2002·23 cites·39 claims
- 0455US7017428B2Test kit for semiconductor package and method for testing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 28, 2006·5 cites·25 claims
- 0539US10120016B2Semiconductor test apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 6, 2018·0 cites·18 claims
- 0634US2004145387A1Integrated monitoring burn-in test method for multi-chip packageFiled 2004·Application pending·0 cites
- 0734US2016061884A1Contact structure for a test handler, test handler having the contact structure and method of testing integrated circuit devices using the test handlerSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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