Inventor · disambiguated record
Rosemary A. Previti-Kelly
Also filed as: PREVITI-KELLY ROSEMARY A · PREVITI-KELLY ROSEMARY ANN
36 granted patents·1,757 citations·filing 1985–2003
98Inventor score
Top patents by PatentIndex Score
36 records- 0199US5326430ACooling microfan arrangements and processIBM·Filed 1993·Granted Jul 5, 1994·174 cites·7 claims
- 0296US5219788ABilayer metallization cap for photolithographyIBM·Filed 1991·Granted Jun 15, 1993·425 cites·20 claims
- 0396US5126006APlural level chip maskingIBM·Filed 1991·Granted Jun 30, 1992·133 cites·35 claims
- 0492US5296775ACooling microfan arrangements and processIBM·Filed 1992·Granted Mar 22, 1994·66 cites·13 claims
- 0591US6495917B1Method and structure of column interconnectIBM·Filed 2000·Granted Dec 17, 2002·71 cites·13 claims
- 0687US5194928APassivation of metal in metal/polyimide structureIBM·Filed 1992·Granted Mar 16, 1993·99 cites·7 claims
- 0785US4723978AMethod for a plasma-treated polysiloxane coatingIBM·Filed 1985·Granted Feb 9, 1988·73 cites·10 claims
- 0884US5114757AEnhancement of polyimide adhesion on reactive metalsLINDE HAROLD G·Filed 1990·Granted May 19, 1992·105 cites·28 claims
- 0982US7144490B2Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layerIBM·Filed 2003·Granted Dec 5, 2006·14 cites·7 claims
- 1080US5466636AMethod of forming borderless contacts using a removable mandrelIBM·Filed 1992·Granted Nov 14, 1995·63 cites·24 claims
- 1178US4606998ABarrierless high-temperature lift-off processIBM·Filed 1985·Granted Aug 19, 1986·53 cites·21 claims
- 1276US5091289AProcess for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositionsIBM·Filed 1990·Granted Feb 25, 1992·56 cites·13 claims
- 1375US4981530APlanarizing ladder-type silsesquioxane polymer insulation layerIBM·Filed 1988·Granted Jan 1, 1991·43 cites·14 claims
- 1474US5397741AProcess for metallized vias in polyimideIBM·Filed 1993·Granted Mar 14, 1995·48 cites·21 claims
- 1574US5043789APlanarizing silsesquioxane copolymer coatingIBM·Filed 1990·Granted Aug 27, 1991·54 cites·22 claims
- 1672US6458630B1Antifuse for use with low k dielectric foam insulatorsIBM·Filed 1999·Granted Oct 1, 2002·33 cites·19 claims
- 1770US6452265B1Multi-chip module utilizing a nonconductive material surrounding the chips that has a similar coefficient of thermal expansionIBM·Filed 2000·Granted Sep 17, 2002·16 cites·8 claims
- 1867US5552638AMetallized vias in polyimideIBM·Filed 1994·Granted Sep 3, 1996·33 cites·6 claims
- 1964US5503961AProcess for forming multilayer lift-off structuresIBM·Filed 1994·Granted Apr 2, 1996·15 cites·25 claims
- 2064US5451655AProcess for making thermostable coating materialsIBM·Filed 1994·Granted Sep 19, 1995·7 cites·15 claims
- 2160US5710460AStructure for reducing microelectronic short circuits using spin-on glass as part of the interlayer dielectricIBM·Filed 1995·Granted Jan 20, 1998·24 cites·11 claims
- 2260US5114754APassivation of metal in metal/polyimide structuresIBM·Filed 1991·Granted May 19, 1992·30 cites·28 claims
- 2358US6388337B1Post-processing a completed semiconductor deviceIBM·Filed 2000·Granted May 14, 2002·7 cites·11 claims
- 2458US5286572APlanarizing ladder-type silsequioxane polymer insulation layerIBM·Filed 1992·Granted Feb 15, 1994·18 cites·15 claims
- 2553US5229257AProcess for forming multi-level coplanar conductor/insulator films employing photosensitive polymide polymer compositionsIBM·Filed 1990·Granted Jul 20, 1993·22 cites·11 claims
- 2652US6496053B1Corrosion insensitive fusible link using capacitance sensing for semiconductor devicesIBM·Filed 1999·Granted Dec 17, 2002·17 cites·6 claims
- 2752US6174824B1Post-processing a completed semiconductor deviceIBM·Filed 1999·Granted Jan 16, 2001·16 cites·8 claims
- 2851US6713838B2Inductive fuse for semiconductor deviceIBM·Filed 2001·Granted Mar 30, 2004·3 cites·20 claims
- 2951US5766808AProcess for forming multilayer lift-off structuresIBM·Filed 1997·Granted Jun 16, 1998·11 cites·7 claims
- 3049US6335229B1Inductive fuse for semiconductor deviceIBM·Filed 1999·Granted Jan 1, 2002·11 cites·16 claims
- 3145US5006488AHigh temperature lift-off processIBM·Filed 1989·Granted Apr 9, 1991·12 cites·10 claims
- 3243US6455434B1Prevention of slurry build-up within wafer topography during polishingIBM·Filed 2001·Granted Sep 24, 2002·2 cites·10 claims
- 3340US6835973B2Antifuse for use with low κ dielectric foam insulatorsIBM·Filed 2002·Granted Dec 28, 2004·0 cites·18 claims
- 3437US5641838AThermostable coating materialsIBM·Filed 1995·Granted Jun 24, 1997·1 cites·10 claims
- 3532US5569731AN,N' disubstituted perylene diamideFiled 1995·Granted Oct 29, 1996·0 cites·1 claims
- 3626US5166038AEtch resistant pattern formation via interfacial silylation processIBM·Filed 1989·Granted Nov 24, 1992·2 cites·14 claims
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