Inventor · disambiguated record
Takashi Shuto
Also filed as: SHUTO TAKASHI
11 granted patents·152 citations·filing 2003–2019
89Inventor score
Top patents by PatentIndex Score
11 records- 0197US10522483B2Package assembly for embedded die and associated techniques and configurationsINTEL CORP·Filed 2019·Granted Dec 31, 2019·37 cites·10 claims
- 0293US7002080B2Multilayer wiring boardFUJITSU LTD·Filed 2003·Granted Feb 21, 2006·69 cites·9 claims
- 0391US9685414B2Package assembly for embedded die and associated techniques and configurationsINTEL CORP·Filed 2013·Granted Jun 20, 2017·11 cites·13 claims
- 0486US10153473B2Separator for electricity storage device, laminate and porous filmASAHI KASEI E MAT CORPORATION·Filed 2013·Granted Dec 11, 2018·5 cites·12 claims
- 0584US10014263B2Package assembly for embedded die and associated techniques and configurationsINTEL CORP·Filed 2017·Granted Jul 3, 2018·3 cites·20 claims
- 0675US7152314B2Method of manufacturing circuit boardFUJITSU LTD·Filed 2004·Granted Dec 26, 2006·21 cites·15 claims
- 0772US7377030B2Wiring board manufacturing methodFUJITSU LTD·Filed 2005·Granted May 27, 2008·6 cites·6 claims
- 0864US10811659B2Separator for electricity storage device, laminate and porous filmASAHI KASEI E MAT CORPORATION·Filed 2018·Granted Oct 20, 2020·0 cites·6 claims
- 0958US10304785B2Package assembly for embedded die and associated techniques and configurationsINTEL CORP·Filed 2018·Granted May 28, 2019·0 cites·20 claims
- 1055US7935891B2Wiring board manufacturing methodFUJITSU LTD·Filed 2008·Granted May 3, 2011·0 cites·1 claims
- 1150US9887110B2Substrate warpage control using temper glass with uni-directional heatingINTEL CORP·Filed 2014·Granted Feb 6, 2018·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →