Inventor · disambiguated record
Qiuxiao Qian
Also filed as: QIAN QIUXIAO
15 granted patents·4 pending applications·92 citations·filing 2007–2024
92Inventor score
Top patents by PatentIndex Score
19 records- 0187US8018054B2Semiconductor die package including multiple semiconductor diceFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Sep 13, 2011·16 cites·16 claims
- 0286US7825502B2Semiconductor die packages having overlapping dice, system using the same, and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Nov 2, 2010·16 cites·30 claims
- 0383US8421204B2Embedded semiconductor power modules and packagesLIU YONG·Filed 2011·Granted Apr 16, 2013·7 cites·26 claims
- 0479US8138585B2Four mosfet full bridge moduleLIU YONG·Filed 2008·Granted Mar 20, 2012·12 cites·19 claims
- 0578US7768123B2Stacked dual-die packages, methods of making, and systems incorporating said packagesFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Aug 3, 2010·9 cites·28 claims
- 0676US8023279B2FLMP buck converter with a molded capacitor and a method of the sameFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Sep 20, 2011·7 cites·16 claims
- 0770US8063474B2Embedded die package on package (POP) with pre-molded leadframeLIU YONG·Filed 2008·Granted Nov 22, 2011·4 cites·37 claims
- 0870US7915721B2Semiconductor die package including IC driver and bridgeFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Mar 29, 2011·4 cites·20 claims
- 0969US7745244B2Pin substrate and packageFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jun 29, 2010·4 cites·15 claims
- 1068US8674490B2Semiconductor die package including IC driver and bridgeLIU YONG·Filed 2011·Granted Mar 18, 2014·2 cites·20 claims
- 1168US8389338B2Embedded die package on package (POP) with pre-molded leadframeLIU YONG·Filed 2011·Granted Mar 5, 2013·2 cites·22 claims
- 1268US7829988B2Stacking quad pre-molded component packages, systems using the same, and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Nov 9, 2010·4 cites·22 claims
- 1361US7750445B2Stacked synchronous buck converterFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Jul 6, 2010·2 cites·15 claims
- 1460US8063472B2Semiconductor package with stacked dice for a buck converterLIU YONG·Filed 2008·Granted Nov 22, 2011·2 cites·18 claims
- 1555US8367481B2Four MOSFET full bridge moduleFAIRCHILD SEMICONDUCTOR·Filed 2012·Granted Feb 5, 2013·1 cites·8 claims
- 1647US2024040754A1Power semiconductor modules and method for their assemblingNEXPERIA TECH SHANGHAI LTD·Filed 2023·Application pending·0 cites
- 1744US2024404958A1Power module package and manufacture method thereofNEXPERIA TECH SHANGHAI LTD·Filed 2024·Application pending·0 cites
- 1839US2012326170A1Wafer level molded opto-couplersLIU YONG·Filed 2011·Application pending·0 cites
- 1938US2009256245A1Stacked Micro-Module Packages, Systems Using the Same, and Methods of Making the SameLIU YONG·Filed 2008·Application pending·0 cites
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