Inventor · disambiguated record
Yu-Ru Yang
Also filed as: YANG YU-RU
30 granted patents·5 pending applications·166 citations·filing 1998–2022
96Inventor score
Top patents by PatentIndex Score
35 records- 0195US10269868B1Semiconductor structure and the method of making the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 23, 2019·12 cites·12 claims
- 0294US10177311B1Resistive random access memory (RRAM) and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 8, 2019·11 cites·20 claims
- 0393US10283564B1Semiconductor structure and the method of making the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 7, 2019·8 cites·18 claims
- 0492US10068963B2Fin-type field effect transistor and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 4, 2018·7 cites·9 claims
- 0592US8766319B2Semiconductor device with ultra thin silicide layerLAI KUO-CHIH·Filed 2012·Granted Jul 1, 2014·16 cites·2 claims
- 0691US8310012B2Semiconductor device having metal gate and manufacturing method thereofHWANG GUANG-YAW·Filed 2010·Granted Nov 13, 2012·16 cites·17 claims
- 0790US11545521B2Magnetic tunnel junction (MTJ) device and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 3, 2023·2 cites·16 claims
- 0889US9318389B1Integrated circuit having plural transistors with work function metal gate structuresUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 19, 2016·10 cites·9 claims
- 0981US9754841B2Method of forming integrated circuit having plural transistors with work function metal gate structuresUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 5, 2017·3 cites·9 claims
- 1080US7397124B2Process of metal interconnectsUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jul 8, 2008·8 cites·14 claims
- 1180US6849541B1Method of fabricating a dual damascene copper wireUNITED MICROELECTRONICS CORP·Filed 2003·Granted Feb 1, 2005·29 cites·19 claims
- 1278US11950431B2Magnetic tunnel junction (MTJ) device and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
- 1377US8587128B2Damascene structureYANG YU-RU·Filed 2012·Granted Nov 19, 2013·5 cites·11 claims
- 1467US7199040B2Barrier layer structureUNITED MICROELECTRONICS CORP·Filed 2004·Granted Apr 3, 2007·8 cites·8 claims
- 1560US10943948B2Magnetic tunnel junction (MTJ) device and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Mar 9, 2021·0 cites·10 claims
- 1658US10636794B2Magnetic tunnel junction structure of magnetic random access memory cellUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 28, 2020·0 cites·10 claims
- 1758US10439023B2Fin-type field effect transistor and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 8, 2019·0 cites·12 claims
- 1857US11818966B2Resistive random access memory and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 14, 2023·0 cites·16 claims
- 1956US10177231B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 8, 2019·0 cites·9 claims
- 2055US8993390B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Mar 31, 2015·0 cites·16 claims
- 2155US7645698B2Method for forming barrier layerUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jan 12, 2010·0 cites·16 claims
- 2253US6043148AMethod of fabricating contact plugUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 28, 2000·21 cites·15 claims
- 2353US2010072622A1Method for forming Barrier Layer and the Related Damascene StructureUNITED MICROELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 2452US10312238B2Manufacturing method of magnetic random access memory cellUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 4, 2019·0 cites·10 claims
- 2552US9837493B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 5, 2017·0 cites·7 claims
- 2651US9349822B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted May 24, 2016·0 cites·17 claims
- 2749US9673040B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 6, 2017·0 cites·11 claims
- 2843US2004251548A1Method for forming barrier layer and structureUNITED MICROELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 2942US5990004AMethod for forming a tungsten plug and a barrier layer in a contact of high aspect ratioUNITED MICROELECTRONICS CORP·Filed 1998·Granted Nov 23, 1999·10 cites·5 claims
- 3041US9590041B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Mar 7, 2017·0 cites·8 claims
- 3140US2005098892A1Structure and process of metal interconnectsFiled 2003·Application pending·0 cites
- 3238US10573649B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 25, 2020·0 cites·9 claims
- 3338US2009225490A1Capacitor structureLIAO TSUOE-HSIANG·Filed 2008·Application pending·0 cites
- 3435US10497797B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 3, 2019·0 cites·6 claims
- 3535US2011254060A1Metal Gate Structure and Fabricating Method thereofUNITED MICROELECTRONICS CORP·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →