Inventor · disambiguated record
Chih-Jen Hsiao
Also filed as: HSIAO CHIH-JEN
13 granted patents·4 pending applications·159 citations·filing 2005–2020
90Inventor score
Files withADVANCED CONNECTEK INC4ACON OPTICS COMMUNICATIONS INC3VANGUARD INT SEMICONDUCT CORP3ZHEN DING TECHNOLOGY CO LTD3HSIAO CHIA WEI1
Top patents by PatentIndex Score
17 records- 0198US11201234B1High electron mobility transistorVANGUARD INT SEMICONDUCT CORP·Filed 2020·Granted Dec 14, 2021·10 cites·18 claims
- 0296US7667663B2Coupling antennaADVANCED CONNECTEK INC·Filed 2008·Granted Feb 23, 2010·115 cites·4 claims
- 0392US11133246B1Semiconductor structure employing conductive paste on lead frameVANGUARD INT SEMICONDUCT CORP·Filed 2020·Granted Sep 28, 2021·3 cites·20 claims
- 0487US10178793B1Rack-mount chassisADVANCED CONNECTEK INC·Filed 2018·Granted Jan 8, 2019·6 cites·14 claims
- 0585US10852486B2Adaptor with built-in shutter for optical connectorACON OPTICS COMMUNICATIONS INC·Filed 2019·Granted Dec 1, 2020·5 cites·8 claims
- 0680US10416392B2Optical adapterADVANCED CONNECTEK INC·Filed 2019·Granted Sep 17, 2019·3 cites·10 claims
- 0775US10847712B2Magnetoresistor devices and methods for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2019·Granted Nov 24, 2020·1 cites·17 claims
- 0870US7528781B2Circularly polarized antennaADVANCED CONNECTEK INC·Filed 2008·Granted May 5, 2009·7 cites·8 claims
- 0960USD892742SOptical fiber connectorACON OPTICS COMMUNICATIONS INC·Filed 2018·Granted Aug 11, 2020·8 cites·1 claims
- 1058US8951848B2Circuit substrate for mounting chip, method for manufacturing same and chip package having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Feb 10, 2015·1 cites·6 claims
- 1152US10901154B2Fiber optical connectorACON OPTICS COMMUNICATIONS INC·Filed 2019·Granted Jan 26, 2021·0 cites·10 claims
- 1242US9357647B2Packaging substrate, method for manufacturing same, and chip packaging body having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted May 31, 2016·0 cites·7 claims
- 1342US2014085833A1Chip packaging substrate, method for manufacturing same, and chip packaging structure having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 1439US2007146208A1Antenna having patch arrays integrally formed with a network thereofLEE KUAN-WEI·Filed 2006·Application pending·0 cites
- 1534US2006140080A1Multi-function digital optical disc playerYEN WEN-YI·Filed 2005·Application pending·0 cites
- 1630US10179537B2Smart brake warning systemHSIAO CHIA WEI·Filed 2017·Granted Jan 15, 2019·0 cites·6 claims
- 1723US2019372214A1Antenna Structure Having Dual Feeds and Improved IsolationSENAO NETWORKS INC·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →