Inventor · disambiguated record
E-Tung Chou
Also filed as: CHOU E-TUNG
10 granted patents·9 pending applications·34 citations·filing 2003–2022
82Inventor score
Files withZHEN DING TECHNOLOGY CO LTD8PHOENIX PIONEER TECHNOLOGY CO LTD4CHOU E-TUNG2PHOENIX PREC TECHNOLOGY CORP2CHANG MING Y1
Top patents by PatentIndex Score
19 records- 0184US7396753B2Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the samePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Jul 8, 2008·14 cites·7 claims
- 0283US7399399B2Method for manufacturing semiconductor package substratePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Jul 15, 2008·18 cites·6 claims
- 0360US9589935B2Package apparatus and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Mar 7, 2017·1 cites·20 claims
- 0458US8951848B2Circuit substrate for mounting chip, method for manufacturing same and chip package having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Feb 10, 2015·1 cites·6 claims
- 0550US12293976B2Semiconductor EMI shielding component, semiconductor package structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted May 6, 2025·0 cites·19 claims
- 0646US9601402B2Package apparatus and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Mar 21, 2017·0 cites·34 claims
- 0744US2015382469A1Package apparatus and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 0842US9357647B2Packaging substrate, method for manufacturing same, and chip packaging body having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted May 31, 2016·0 cites·7 claims
- 0942US9173298B2Packaging substrate, method for manufacturing same, and chip packaging structure having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Oct 27, 2015·0 cites·5 claims
- 1042US2014085833A1Chip packaging substrate, method for manufacturing same, and chip packaging structure having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 1141US2014036465A1Packaging substrate, method for manufacturing same, and chip packaging body having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 1241US2006243482A1Circuit board structure and method for fabricating the sameCHOU E-TUNG·Filed 2006·Application pending·0 cites
- 1341US2006237389A1Method for fabricating interlayer conducting structure of circuit boardCHOU E-TUNG·Filed 2006·Application pending·0 cites
- 1438US2006273458A1Substrate structure of semiconductor packageHUANG WEN-SHIEN·Filed 2006·Application pending·0 cites
- 1537US2004099961A1Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the sameFiled 2003·Application pending·0 cites
- 1636US2007087587A1Method for manufacturing circuit board for semiconductor packageCHANG MING Y·Filed 2006·Application pending·0 cites
- 1736US2015380391A1Packaging substrate, method for manufacturing same, and chip packaging structure having sameZHEN DING TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 1835US9362248B2Coreless package structure and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2014·Granted Jun 7, 2016·0 cites·16 claims
- 1935US9165790B2Packaging substrate, method for manufacturing same, and chip packaging body having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Oct 20, 2015·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →